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    Last update 7 years 3 months by Takaharu Nakajima
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    DESCRIPTION
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<circle x="0" y="0" radius="0.762" width="0.1524" layer="51"/>
<circle x="0" y="0" radius="0.381" width="0.254" layer="51"/>
<pad name="MP" x="0" y="0" drill="1.397" diameter="2.54" shape="octagon"/>
<text x="-1.397" y="1.778" size="1.27" layer="25" ratio="10">&gt;NAME</text>
<text x="0" y="0.381" size="0.0254" layer="27">&gt;VALUE</text>
</package>
<package name="LSP10">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt;
drill 1.0 mm</description>
<wire x1="-1.27" y1="0.254" x2="-1.27" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="1.27" y1="0.254" x2="1.27" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="1.27" y1="0.254" x2="1.143" y2="0.254" width="0.1524" layer="21"/>
<wire x1="1.27" y1="-0.254" x2="1.143" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="-1.27" y1="-0.254" x2="-1.143" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="-1.27" y1="0.254" x2="-1.143" y2="0.254" width="0.1524" layer="21"/>
<wire x1="1.143" y1="0.254" x2="0.635" y2="0.254" width="0.1524" layer="51"/>
<wire x1="-1.143" y1="-0.254" x2="-0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="0.254" x2="0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="0.254" x2="-0.635" y2="0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="-0.254" x2="1.143" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="0.254" x2="-0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="0.254" x2="-1.143" y2="0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="-0.254" x2="0.635" y2="-0.254" width="0.1524" layer="51"/>
<pad name="MP" x="0" y="0" drill="1.016" diameter="2.159" shape="octagon"/>
<text x="-1.27" y="1.27" size="1.27" layer="25" ratio="10">&gt;NAME</text>
<text x="0" y="0.254" size="0.0254" layer="27">&gt;VALUE</text>
</package>
<package name="LSP11">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt;
drill 1.1 mm</description>
<wire x1="-1.27" y1="0.254" x2="-1.27" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="1.27" y1="0.254" x2="1.27" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="1.27" y1="0.254" x2="1.143" y2="0.254" width="0.1524" layer="21"/>
<wire x1="1.27" y1="-0.254" x2="1.143" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="-1.27" y1="-0.254" x2="-1.143" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="-1.27" y1="0.254" x2="-1.143" y2="0.254" width="0.1524" layer="21"/>
<wire x1="1.143" y1="0.254" x2="0.635" y2="0.254" width="0.1524" layer="51"/>
<wire x1="-1.143" y1="-0.254" x2="-0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="0.254" x2="0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="0.254" x2="-0.635" y2="0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="-0.254" x2="1.143" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="0.254" x2="-0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="0.254" x2="-1.143" y2="0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="-0.254" x2="0.635" y2="-0.254" width="0.1524" layer="51"/>
<pad name="MP" x="0" y="0" drill="1.1176" diameter="2.159" shape="octagon"/>
<text x="-1.27" y="1.27" size="1.27" layer="25" ratio="10">&gt;NAME</text>
<text x="0" y="0.254" size="0.0254" layer="27">&gt;VALUE</text>
</package>
<package name="LSP13">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt;
drill 1.3 mm</description>
<wire x1="-1.524" y1="0.254" x2="-1.524" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="1.524" y1="0.254" x2="1.524" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="1.524" y1="0.254" x2="1.143" y2="0.254" width="0.1524" layer="21"/>
<wire x1="1.524" y1="-0.254" x2="1.143" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="-1.524" y1="-0.254" x2="-1.143" y2="-0.254" width="0.1524" layer="21"/>
<wire x1="-1.524" y1="0.254" x2="-1.143" y2="0.254" width="0.1524" layer="21"/>
<wire x1="1.143" y1="0.254" x2="0.635" y2="0.254" width="0.1524" layer="51"/>
<wire x1="-1.143" y1="-0.254" x2="-0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="0.254" x2="0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="0.254" x2="-0.635" y2="0.254" width="0.1524" layer="51"/>
<wire x1="0.635" y1="-0.254" x2="1.143" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="0.254" x2="-0.635" y2="-0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="0.254" x2="-1.143" y2="0.254" width="0.1524" layer="51"/>
<wire x1="-0.635" y1="-0.254" x2="0.635" y2="-0.254" width="0.1524" layer="51"/>
<pad name="MP" x="0" y="0" drill="1.3208" diameter="2.159" shape="octagon"/>
<text x="-1.524" y="1.27" size="1.27" layer="25" ratio="10">&gt;NAME</text>
<text x="0" y="0.254" size="0.0254" layer="27">&gt;VALUE</text>
</package>
</packages>
<symbols>
<symbol name="LSP">
<wire x1="-1.016" y1="2.032" x2="1.016" y2="0" width="0.254" layer="94"/>
<wire x1="-1.016" y1="0" x2="1.016" y2="2.032" width="0.254" layer="94"/>
<circle x="0" y="1.016" radius="1.016" width="0.4064" layer="94"/>
<text x="-1.27" y="2.921" size="1.778" layer="95">&gt;NAME</text>
<pin name="MP" x="0" y="-2.54" visible="off" length="short" direction="pas" rot="R90"/>
</symbol>
</symbols>
<devicesets>
<deviceset name="MCS08" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt; MC S0,8, drill 1.2 mm, distributor Buerklin, 08F130</description>
<gates>
<gate name="G$1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="MCS08">
<connects>
<connect gate="G$1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="LSP10" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt; drill 1.0 mm, distributor Buerklin, 12H555</description>
<gates>
<gate name="1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="LSP10">
<connects>
<connect gate="1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="LSP11" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt;
drill 1.1 mm</description>
<gates>
<gate name="1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="LSP11">
<connects>
<connect gate="1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="LSP13" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt; drill 1.3 mm, distributor Buerklin, 12H562</description>
<gates>
<gate name="1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="LSP13">
<connects>
<connect gate="1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="MCS10B" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt; MC S1, distributor Buerklin, 15F505</description>
<gates>
<gate name="1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="MCS10B">
<connects>
<connect gate="1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="SE11" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt; RTM, drill 1,1mm, distributor Buerklin, 07F810</description>
<gates>
<gate name="1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="SE11">
<connects>
<connect gate="1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="SE13" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt; E1542,  drill 1,3mm, distributor Buerklin, 07F815</description>
<gates>
<gate name="1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="SE13">
<connects>
<connect gate="1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="SE14" prefix="LSP">
<description>&lt;b&gt;SOLDER PAD&lt;/b&gt;&lt;p&gt; E1553,  drill 1,4mm, distributor Buerklin, 07F820</description>
<gates>
<gate name="1" symbol="LSP" x="0" y="0"/>
</gates>
<devices>
<device name="" package="SE14">
<connects>
<connect gate="1" pin="MP" pad="MP"/>
</connects>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
</devicesets>
</library>
</drawing>
</eagle>
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