Files

QFN44ML7X7-SK.kicad_mod
(footprint "QFN44ML7X7-SK" (version 20211014) (generator pcbnew) (layer "F.Cu") (tedit 0) (fp_text reference "REF**" (at -3.9 -4.55) (layer "F.SilkS") (effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom)) (tstamp 599422e5-d0e9-483e-959c-8f7aa445cc5f) ) (fp_text value ">VALUE" (at -3.9 5.525) (layer "F.Fab") (effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom)) (tstamp 76aa0038-4cce-49ff-9e03-1fb20b630f60) ) (fp_circle (center 0 0) (end 0.635 0) (layer "F.Paste") (width 1.27) (fill none) (tstamp 2a0695bf-a92d-42e4-8fce-dbe71af8e1ee)) (fp_line (start -3.4798 -3.4798) (end -2.8194 -3.4798) (layer "F.SilkS") (width 0.12) (tstamp 0218c681-4376-4c7f-8197-37c136ffd663)) (fp_line (start 3.4544 2.7686) (end 3.4544 3.429) (layer "F.SilkS") (width 0.12) (tstamp 4f90d103-0e6b-42ee-a09d-ffd2f0289dc7)) (fp_line (start -3.4036 -3.4798) (end -2.54 -2.54) (layer "F.SilkS") (width 0.12) (tstamp 70bb8f9c-aaf5-493e-bc54-74d1ecdfd74e)) (fp_line (start 3.4544 3.429) (end 2.794 3.429) (layer "F.SilkS") (width 0.12) (tstamp 9e4dd7b3-83f4-4f0f-b51d-f1deef44bb27)) (fp_line (start -3.4798 -2.794) (end -3.4798 -3.4798) (layer "F.SilkS") (width 0.12) (tstamp a8afaeec-0380-4912-aec5-713dbf17666a)) (fp_line (start 2.794 -3.4798) (end 3.4544 -3.4798) (layer "F.SilkS") (width 0.12) (tstamp bb91408a-c995-40be-875a-28ca2ca6bda5)) (fp_line (start -2.794 3.429) (end -3.4036 3.429) (layer "F.SilkS") (width 0.12) (tstamp e60089de-b5ad-45a9-af07-bf7ccc8bb764)) (fp_line (start -3.4036 3.429) (end -3.4036 2.8194) (layer "F.SilkS") (width 0.12) (tstamp ed8c179b-57c0-422d-8855-d389822dd1f1)) (fp_line (start 3.4544 -3.4798) (end 3.4544 -2.794) (layer "F.SilkS") (width 0.12) (tstamp fd2d4193-94a7-44d0-aba5-c14f906eba70)) (fp_circle (center 0 0) (end 0.635 0) (layer "F.Mask") (width 2.54) (fill none) (tstamp fc156228-6de3-4a1e-a350-46de7d474305)) (fp_line (start 3.5 3.5) (end 3.5 -3.5) (layer "F.Fab") (width 0.2032) (tstamp 025790bc-d0e6-4ade-bfe2-43ab72e5a01d)) (fp_line (start -3.5 3.5) (end 3.5 3.5) (layer "F.Fab") (width 0.2032) (tstamp 51bfae45-f22c-43be-8cf7-da6a8f19f5a9)) (fp_line (start 3.5 -3.5) (end -3.5 -3.5) (layer "F.Fab") (width 0.2032) (tstamp a8b49fe8-618b-4953-843c-682248ce31fb)) (fp_line (start -3.5 -3.5) (end -3.5 3.5) (layer "F.Fab") (width 0.2032) (tstamp e2927cf6-c343-4fd8-8077-86842c191bc9)) (pad "1" smd roundrect (at -3.275 -2.5) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp e8635bfd-9c08-43ce-9a31-73ff0d182598)) (pad "2" smd roundrect (at -3.275 -2) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp aef2659b-3488-483f-95f9-8d491a064bd7)) (pad "3" smd roundrect (at -3.275 -1.5) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 886ec089-f149-43b6-846d-2fcb5e2d2ee2)) (pad "4" smd roundrect (at -3.275 -1) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 4b1bb6c8-4efd-42e5-bed5-db74fcc7e36b)) (pad "5" smd roundrect (at -3.275 -0.5) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp fce1f4e7-9a00-467b-a426-fa4c9f9fab45)) (pad "6" smd roundrect (at -3.275 0) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 73e82687-5a5a-48b7-94f0-d85e209c3179)) (pad "7" smd roundrect (at -3.275 0.5) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 1bc9ac1e-be7d-4cd7-9946-d6da3227dd87)) (pad "8" smd roundrect (at -3.275 1) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 27fa8672-570d-429c-b041-26ced8cb5a88)) (pad "9" smd roundrect (at -3.275 1.5) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 54a8a7e1-41f1-4ca0-bde8-fa4142d8d411)) (pad "10" smd roundrect (at -3.275 2) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp e70f0d5c-6972-426a-8ac1-3f5199a3a995)) (pad "11" smd roundrect (at -3.275 2.5) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 98bc40ac-2861-4634-9dee-3d93fa247889)) (pad "12" smd roundrect (at -2.5 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 62f614fa-6e07-4079-9958-1861da97ae14)) (pad "13" smd roundrect (at -2 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 12d8060e-5fc4-4a24-87d1-d0ea4aab3095)) (pad "14" smd roundrect (at -1.5 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp df07df68-05dc-4e29-988a-326b4caa38d5)) (pad "15" smd roundrect (at -1 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp d37e5607-981c-4804-88f7-2fc079e82c9e)) (pad "16" smd roundrect (at -0.5 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 7354685d-845a-462b-82e9-233d4c6a8335)) (pad "17" smd roundrect (at 0 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp cffe6818-ca20-4a07-9882-208d6857d355)) (pad "18" smd roundrect (at 0.5 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp e9a57055-69fb-4c41-a4cf-8cba7a0b4e89)) (pad "19" smd roundrect (at 1 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 9deb7850-4d40-46d9-8842-0f146d3c5fa2)) (pad "20" smd roundrect (at 1.5 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 8a76a865-2a04-4545-a9a4-75c1d9df651f)) (pad "21" smd roundrect (at 2 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp d87e4b47-2e6a-4a6f-8a83-67ad05a9fe78)) (pad "22" smd roundrect (at 2.5 3.275 90) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 2c6ef25b-658a-4932-8701-43eb816095d5)) (pad "23" smd roundrect (at 3.275 2.5 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 50670450-6e13-4d42-b316-850c4fb8bae2)) (pad "24" smd roundrect (at 3.275 2 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 2852acd2-0330-4df7-a9c8-1f42ddc8427d)) (pad "25" smd roundrect (at 3.275 1.5 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 3f35e3a9-c58b-4a91-a880-0a88e03f899a)) (pad "26" smd roundrect (at 3.275 1 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp f9dca672-346f-4d6a-967c-38d6d7c82226)) (pad "27" smd roundrect (at 3.275 0.5 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp c1f690a3-0fe4-433e-a712-c98e37376ca0)) (pad "28" smd roundrect (at 3.275 0 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 2a440897-8ea0-45ca-b60d-65291e90a44e)) (pad "29" smd roundrect (at 3.275 -0.5 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 0d51ed4a-0d94-4a23-a994-fc1ce0acad5c)) (pad "30" smd roundrect (at 3.275 -1 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp dc8f54e7-62e1-4a18-91f2-ae3a2ba4b0a9)) (pad "31" smd roundrect (at 3.275 -1.5 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 792e272e-408a-41eb-a0b9-4b7f10cfeaf7)) (pad "32" smd roundrect (at 3.275 -2 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 8051fdcb-e649-4f0a-95d3-4a7f9832defb)) (pad "33" smd roundrect (at 3.275 -2.5 180) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 85a979d8-89e2-429c-bb4a-6eebd9842aec)) (pad "34" smd roundrect (at 2.5 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 72b34288-6269-49fd-8a1b-b6ae1a01e915)) (pad "35" smd roundrect (at 2 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 786a7111-a033-43ec-9d1a-70dccb007fc8)) (pad "36" smd roundrect (at 1.5 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 679c08f7-c00c-4f46-8edf-3b111bfcbaf7)) (pad "37" smd roundrect (at 1 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 3a8fa609-a8c3-493a-8105-776696e7e8f5)) (pad "38" smd roundrect (at 0.5 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 7454403d-1ab7-4892-81c4-4898c1f63aad)) (pad "39" smd roundrect (at 0 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp ed1ac5a6-c991-43db-98cf-73272b698a16)) (pad "40" smd roundrect (at -0.5 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 7576250f-655c-41f8-ab95-77f3f9aea52e)) (pad "41" smd roundrect (at -1 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 8860941a-2aa9-46d5-84b4-995b48a86149)) (pad "42" smd roundrect (at -1.5 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 0b0e97a9-b3a8-4a2e-a7bb-4b4ded229405)) (pad "43" smd roundrect (at -2 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp fdca2895-95ec-4d5b-874b-aa5d3a4f106a)) (pad "44" smd roundrect (at -2.5 -3.275 270) (size 0.75 0.275) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.4) (solder_mask_margin 0.0508) (tstamp 659cce29-5b64-4bd7-a35d-dedbeb60d62c)) (pad "EXP" smd roundrect (at 0 0) (size 4.826 4.826) (layers "F.Cu") (roundrect_rratio 0.05) (solder_mask_margin 0.0508) (tstamp c461ed46-1f13-4804-b9cd-21740a61013c)) )
Report a bug