POWERSUPPLY_DC-21MM_OVAL.kicad_mod
(footprint "POWERSUPPLY_DC-21MM_OVAL" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 0)
  (descr "DC 2.1mm Jack")
  (attr through_hole)
  (fp_text reference "REF**" (at 6.35 6.35 90) (layer "F.SilkS")
    (effects (font (size 1.6891 1.6891) (thickness 0.0889)) (justify left bottom))
    (tstamp d8b5ec37-2b7b-48d8-85dc-e8a3d9df5a71)
  )
  (fp_text value ">VALUE" (at 8.89 6.35 90) (layer "F.Fab")
    (effects (font (size 1.6891 1.6891) (thickness 0.0889)) (justify left bottom))
    (tstamp a8f88309-5cc8-41b5-be77-79cb6e7fc293)
  )
  (fp_line (start -2.8575 6.35) (end -5.08 6.35) (layer "F.SilkS") (width 0.127) (tstamp 31e4aae7-8a65-4897-86de-6a5e5b4112a7))
  (fp_line (start 3.9116 -3.6576) (end 3.9116 -3.6576) (layer "F.SilkS") (width 0.127) (tstamp 4e3931c9-1ce2-4ae4-8eca-8010dd33ea7a))
  (fp_line (start 2.54 6.35) (end 3.9116 6.35) (layer "F.SilkS") (width 0.127) (tstamp 5057cdbb-1fab-419c-ab9b-5051e880269f))
  (fp_line (start -5.08 6.35) (end -5.08 6.0325) (layer "F.SilkS") (width 0.127) (tstamp aeb83f71-8ad3-46b5-a61a-76e6947f613f))
  (fp_line (start -5.0546 -3.6576) (end -5.08 0.635) (layer "F.SilkS") (width 0.127) (tstamp c25bf677-e45f-4b13-9e73-52065ce004db))
  (fp_line (start 3.9116 6.35) (end 3.9116 -3.6576) (layer "F.SilkS") (width 0.127) (tstamp f0146e29-def2-4cfc-8243-a136361a74ae))
  (fp_line (start -5.0546 -3.6576) (end 3.9116 -3.6576) (layer "F.SilkS") (width 0.127) (tstamp fb3d3615-1715-414c-b273-34c22a043665))
  (fp_line (start 3.9116 -7.1374) (end 3.9116 -3.7211) (layer "F.Fab") (width 0.127) (tstamp 6dc9edeb-c696-475d-8ccb-fdca1900168f))
  (fp_line (start 3.9116 -7.1374) (end -5.08 -7.1374) (layer "F.Fab") (width 0.127) (tstamp ca3f25c8-cfe1-440d-bc4a-b2117360340c))
  (fp_line (start -5.08 -7.1374) (end -5.08 -3.7084) (layer "F.Fab") (width 0.127) (tstamp f8a7caca-f3eb-4e6e-99b3-dc63226831ce))
  (pad "1" thru_hole roundrect (at -5.08 3.3528) (size 4 4) (drill oval 1.3 2.83) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
    (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
    (solder_mask_margin 0.0508) (tstamp bf63f21f-35ff-4952-b08e-dc37032829c8))
  (pad "2" thru_hole roundrect (at -0.0762 6.35 90) (size 4 4) (drill oval 1.3 2.83) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
    (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
    (solder_mask_margin 0.0508) (tstamp a1adf411-f134-4916-9a53-2e58ae8e7845))
  (pad "3" thru_hole rect (at -0.0762 0.3556 90) (size 4 4) (drill oval 1.3 2.83) (layers *.Cu *.Mask)
    (solder_mask_margin 0.0508) (tstamp 46b45a8e-0086-4fd1-89ed-f6c08effe2ca))
)