Glasgow Embedded / Glasgow - History

revC3: add URL to back silkscreen, resize VDAC labels on back silkscreen

revC3: add input filter for Vsense

Without this filter, Vsense is sensitive to substantial aliasing on specific frequencies.

Detailed measurements and reasoning in
https://github.com/GlasgowEmbedded/glasgow/issues/221#issuecomment-753531753

revC3: increase spacing of the 3V3 flood fill on the internal power layer around the mounting holes

For ensuring GND contact to a metal case one solution is to use serrated washers on the mounting holes.
In some cases the serrated washers could penetrate through the outer PCB layer and create a short
between 3V3 and GND. With the increased spacing this becomes very unlikely.

None of the areas around the mounting holes is important for current flow or signal referencing.

revC3: change the I2C address of DAC A to remove the address clash with the SMBus Alert Response Request (ARA)

- The SMBus Alert Response Request (ARA) is used by the INA233
- Add notes about this to the schematics
- Also store the correct footprint of the reset IC U7 in the schematics
(was previously just in the layout and the assignment in the schematics wrong)

revC3: fix internal i2c bus testpoint silkscreen labels on top side

Fixes #250

revC3: remove port pinout marking on top silkscreen

As decided in #256

revC3: change silkscreen to "owGglas revC?" to emphasise that it is a development version for now

revC2: Removed the solder mask minimum width setting.

As recommended by KiCad this setting should only be used when explicitly
asked by the PCB manufacturer. It depends on their needs and
capabilities and is usually done as part of gerber file pre processing
done by the PCB manufacturer.

revC2: Moved the front mfr logo anchor to a better spot.

revC2: Corrected resistor pack footprints.

The outer pads of the resistor pack footprints were slightly too small.
This can cause assembly reliability isues.