revC3: add input filter for Vsense Without this filter, Vsense is sensitive to substantial aliasing on specific frequencies. Detailed measurements and reasoning in https://github.com/GlasgowEmbedded/glasgow/issues/221#issuecomment-753531753
by Electronic Eel 3 years 11 months
revC3: increase spacing of the 3V3 flood fill on the internal power layer around the mounting holes For ensuring GND contact to a metal case one solution is to use serrated washers on the mounting holes. In some cases the serrated washers could penetrate through the outer PCB layer and create a short between 3V3 and GND. With the increased spacing this becomes very unlikely. None of the areas around the mounting holes is important for current flow or signal referencing.
by Electronic Eel 3 years 11 months
revC3: change the I2C address of DAC A to remove the address clash with the SMBus Alert Response Request (ARA) - The SMBus Alert Response Request (ARA) is used by the INA233 - Add notes about this to the schematics - Also store the correct footprint of the reset IC U7 in the schematics (was previously just in the layout and the assignment in the schematics wrong)
by Electronic Eel 3 years 11 months
revC3: fix internal i2c bus testpoint silkscreen labels on top side Fixes #250
by Electronic Eel 3 years 11 months
revC3: remove port pinout marking on top silkscreen As decided in #256
by Electronic Eel 3 years 11 months
revC3: change silkscreen to "owGglas revC?" to emphasise that it is a development version for now
by Electronic Eel 3 years 11 months
revC2: Removed the solder mask minimum width setting. As recommended by KiCad this setting should only be used when explicitly asked by the PCB manufacturer. It depends on their needs and capabilities and is usually done as part of gerber file pre processing done by the PCB manufacturer.
by esden 4 years 1 month
revC2: Moved the front mfr logo anchor to a better spot.
by esden 4 years 1 month
revC2: Corrected resistor pack footprints. The outer pads of the resistor pack footprints were slightly too small. This can cause assembly reliability isues.
by esden 4 years 1 month
revC2: Corrected the SOT-143 footprint. The footprint in the KiCad library works but it is too large and could cause assembly reliability issues. The new footprint and 3D model are based on the official Diodes Inc data and match the part we are using.
by esden 4 years 1 month
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