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FilesPCBACCCIAA_ACCfootprintsdfn-qfn.pretty
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HVQFN42.kicad_mod
KSZ9031RNX.kicad_mod
LPC11U35.kicad_mod
LSF0204D.kicad_mod
TPS51206.kicad_mod
TPS53355.kicad_mod
TPS65400.kicad_mod
TXS02612.kicad_mod
USB3320C.kicad_mod
WSON-8.kicad_mod
LPC11U35.kicad_mod
(module LPC11U35 (layer F.Cu) (tedit 56F05A7D) (tags "QFN 0.5") (attr smd) (fp_text reference REF** (at 0 -3.5) (layer F.SilkS) (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_text value LPC11U35 (at 0 -3.5) (layer F.Fab) hide (effects (font (size 0.7112 0.4572) (thickness 0.1016))) ) (fp_circle (center -2.77929 -2.1) (end -2.72929 -2.15) (layer F.SilkS) (width 0.1016)) (fp_line (start -2.5 -2.5) (end -2.5 -1.95) (layer F.SilkS) (width 0.1016)) (fp_line (start -2.5 2.5) (end -2.5 1.95) (layer F.SilkS) (width 0.1016)) (fp_line (start -1.95 2.5) (end -2.5 2.5) (layer F.SilkS) (width 0.1016)) (fp_line (start 2.5 2.5) (end 1.95 2.5) (layer F.SilkS) (width 0.1016)) (fp_line (start 2.5 1.95) (end 2.5 2.5) (layer F.SilkS) (width 0.1016)) (fp_line (start 2.5 -2.5) (end 2.5 -1.95) (layer F.SilkS) (width 0.1016)) (fp_line (start -2.5 -2.5) (end -1.95 -2.5) (layer F.SilkS) (width 0.1016)) (fp_line (start 2.5 -2.5) (end 1.95 -2.5) (layer F.SilkS) (width 0.1016)) (pad 1 smd rect (at -2.55 -1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.55 -1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at -2.55 -0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 4 smd rect (at -2.55 -0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 5 smd rect (at -2.55 0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 6 smd rect (at -2.55 0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 7 smd rect (at -2.55 1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 8 smd rect (at -2.55 1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at -1.75 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 10 smd rect (at -1.25 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 11 smd rect (at -0.75 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 12 smd rect (at -0.25 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 13 smd rect (at 0.25 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 14 smd rect (at 0.75 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 15 smd rect (at 1.25 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 16 smd rect (at 1.75 2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 17 smd rect (at 2.55 1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 18 smd rect (at 2.55 1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 19 smd rect (at 2.55 0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 20 smd rect (at 2.55 0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 21 smd rect (at 2.55 -0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 22 smd rect (at 2.55 -0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 23 smd rect (at 2.55 -1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 24 smd rect (at 2.55 -1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 25 smd rect (at 1.75 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 26 smd rect (at 1.25 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 27 smd rect (at 0.75 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 28 smd rect (at 0.25 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 29 smd rect (at -0.25 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 30 smd rect (at -0.75 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 31 smd rect (at -1.25 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 32 smd rect (at -1.75 -2.55 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask)) (pad 33 thru_hole rect (at 1.25 1.25) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at 1.25 -1.25) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at -1.25 1.25) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at 0 -1.25) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at 1.25 0) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at 0 0) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at -1.25 0) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at 0 1.25) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (pad 33 thru_hole rect (at -1.25 -1.25) (size 1.25 1.25) (drill 0.7112) (layers *.Cu *.Mask F.Paste) (solder_paste_margin_ratio -0.15)) (model footprints/dfn-qfn.3dshapes/LPC11U35.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )
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