Michael Pham / PROVES Flight Controller Board - Files

E22-400M30S.kicad_mod
(footprint E22-400M30S (layer F.Cu) (tedit 67B6700E)
  (descr "")
  (attr smd)
  (fp_text reference "REF**" (at 0 0) (layer F.SilkS)
    (effects (font (size 0.787401574803 0.787401574803) (thickness 0.15)))
  )
  (fp_text value "E22-400M30S" (at 0 0) (layer F.Fab)
    (effects (font (size 0.787401574803 0.787401574803) (thickness 0.15)))
  )
  (pad 22-GND smd rect (at 0.3 -5.46) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 21-ANT smd rect (at 0.3 -8.0) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 20-GND smd rect (at 0.3 -10.54) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 19-NSS smd rect (at 0.3 -18.14) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 18-SCK smd rect (at 0.3 -20.68) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 17-MOSI smd rect (at 0.3 -23.22) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 16-MISO smd rect (at 0.3 -25.76) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 15-NRESET smd rect (at 0.3 -28.3) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 14-BUSY smd rect (at 0.3 -30.84) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 13-DIO1 smd rect (at 0.3 -33.38) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 12-GND smd rect (at 0.3 -35.92) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 1-GND smd rect (at 23.7 -5.46) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2-GND smd rect (at 23.7 -8.0) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3-GND smd rect (at 23.7 -10.54) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4-GND smd rect (at 23.7 -18.14) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5-GND smd rect (at 23.7 -20.68) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6-RXEN smd rect (at 23.7 -23.22) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7-TXEN smd rect (at 23.7 -25.76) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8-DIO2 smd rect (at 23.7 -28.3) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 9-VCC smd rect (at 23.7 -30.84) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 10-VCC smd rect (at 23.7 -33.38) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 11-GND smd rect (at 23.7 -35.92) (size 2.4 1.5) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (fp_line (start 0.0 0.0) (end 24.0 0.0) (layer F.Fab) (width 0.1524))
  (fp_line (start 24.0 0.0) (end 24.0 -38.53) (layer F.Fab) (width 0.1524))
  (fp_line (start 24.0 -38.53) (end 0.0 -38.53) (layer F.Fab) (width 0.1524))
  (fp_line (start 0.0 -38.53) (end 0.0 0.0) (layer F.Fab) (width 0.1524))
  (fp_line (start 0.0 0.0) (end 0.0 0.05) (layer F.Fab) (width 0.1524))
  (fp_line (start 0.0 0.05) (end 0.05 0.05) (layer F.Fab) (width 0.1524))
  (fp_line (start 0.05 0.05) (end 0.05 -0.01) (layer F.Fab) (width 0.1524))
  (fp_line (start 0.05 -0.01) (end 0.03 -0.01) (layer F.Fab) (width 0.1524))
  (fp_text user "E22-400M30S" (at 2.04 -1.59) (layer Dwgs.User)
    (effects (font (size 1.4 1.4) (thickness 0.15)))
  )
)