Michael Pham / PROVES Flight Controller Board - Files

BNO080.kicad_mod
(footprint "BNO080" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 0)
  (fp_text reference "REF**" (at -2.64 -2.248) (layer "F.SilkS")
    (effects (font (size 0.666496 0.666496) (thickness 0.146304)) (justify left bottom))
    (tstamp fb3412ba-0343-4e26-a35b-7404b62c968c)
  )
  (fp_text value ">VALUE" (at -2.64 2.61) (layer "F.Fab")
    (effects (font (size 0.36576 0.36576) (thickness 0.04064)) (justify left bottom))
    (tstamp 83851696-2749-4ed6-91c2-abad37453d7a)
  )
  (fp_line (start -2.7 2) (end -2.7 -2) (layer "F.SilkS") (width 0.127) (tstamp 02dd041f-3838-4b98-b560-8ea5414d3606))
  (fp_line (start 2.7 -2) (end 2.7 2) (layer "F.SilkS") (width 0.127) (tstamp 778a9fc5-6232-4f6d-ac9c-bcb68b60f1ef))
  (fp_line (start -2.7 -2) (end 2.7 -2) (layer "F.SilkS") (width 0.127) (tstamp b501ecd6-7203-437f-a4ff-8d6ab52ca564))
  (fp_line (start 2.7 2) (end -2.7 2) (layer "F.SilkS") (width 0.127) (tstamp c1f7f196-7104-46a2-8f5e-9de3a6930aa1))
  (fp_circle (center -3.3 -1.5) (end -3.076394 -1.5) (layer "F.SilkS") (width 0.4064) (fill none) (tstamp 036eedf7-29f2-4326-bf50-c35d6e1b079e))
  (fp_line (start -2.6 -1.9) (end 2.6 -1.9) (layer "F.Fab") (width 0.127) (tstamp 3c5b6e93-bd32-41db-81b7-826513cdec83))
  (fp_line (start 2.6 1.9) (end -2.6 1.9) (layer "F.Fab") (width 0.127) (tstamp 3d573e88-f92f-4875-89e8-f07709f401b5))
  (fp_line (start 2.6 -1.9) (end 2.6 1.9) (layer "F.Fab") (width 0.127) (tstamp 60afc410-2008-4195-9f70-0a80f93ce33d))
  (fp_line (start -2.6 1.9) (end -2.6 -1.9) (layer "F.Fab") (width 0.127) (tstamp b16fb079-13ab-494d-8b37-4c0ab1355897))
  (pad "1" smd rect (at -2.25 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 561f362a-7ac4-47db-a22a-bdb3ba60999f))
  (pad "2" smd rect (at -2.3125 -0.75 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 2abe793a-9732-4c74-819e-08c56cf9b7f8))
  (pad "3" smd rect (at -2.3125 -0.25 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 0bfcf40b-8f0b-43a2-a2e2-5cc132709d96))
  (pad "4" smd rect (at -2.3125 0.25 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp f117a65a-1368-4d92-bec4-b9b536326edc))
  (pad "5" smd rect (at -2.3125 0.75 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 1a90ce1d-f423-41c4-ba46-65a4eb04012c))
  (pad "6" smd rect (at -2.25 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp d9f5feb9-10cf-4a6a-954c-2ca3bff8a0d6))
  (pad "7" smd rect (at -1.75 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp b4973d36-1d71-4f9e-8dc5-1544ab93033c))
  (pad "8" smd rect (at -1.25 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 93f60551-1a35-41f9-81fd-86b20bea34ec))
  (pad "9" smd rect (at -0.75 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 6b834679-2b9d-4d81-95ac-e2cc61be7e75))
  (pad "10" smd rect (at -0.25 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 3592c832-75af-47c6-a033-9faa08637eaf))
  (pad "11" smd rect (at 0.25 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 378241ed-00ca-4770-977c-f7cb0c0c3859))
  (pad "12" smd rect (at 0.75 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 0f768cf7-8b6f-42d5-9afb-88176895e735))
  (pad "13" smd rect (at 1.25 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 517e5bc1-dd19-491b-82c7-5fa108126e89))
  (pad "14" smd rect (at 1.75 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp e7afb586-dbe5-42a3-a2b6-d190ec590e79))
  (pad "15" smd rect (at 2.25 1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 484af8f6-3c07-4393-bc11-83ea21c93e60))
  (pad "16" smd rect (at 2.3125 0.75 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 0de3ed1d-92de-4dee-8519-1f47ac79e794))
  (pad "17" smd rect (at 2.3125 0.25 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 6f3f946d-5c0d-4ef5-b469-bc29cc07126d))
  (pad "18" smd rect (at 2.3125 -0.25 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp b8b4ce39-16e3-4bc7-bef0-b464cddd0e2f))
  (pad "19" smd rect (at 2.3125 -0.75 90) (size 0.25 0.575) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 9150a335-1baa-4c60-ac71-4a7b442a9368))
  (pad "20" smd rect (at 2.25 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp bf59a225-34c0-474a-98e9-becb022ddebc))
  (pad "21" smd rect (at 1.75 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 1829aaab-3a46-4ef1-8946-3364d080e229))
  (pad "22" smd rect (at 1.25 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 6ceb65df-740f-449b-a20a-6f5d2577aeb1))
  (pad "23" smd rect (at 0.75 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 101cfecd-808a-4106-aa5e-2edf085eb5c9))
  (pad "24" smd rect (at 0.25 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp f0b5d960-a73a-4134-8ee6-84f9b62e050b))
  (pad "25" smd rect (at -0.25 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 0da930b1-b92b-45f9-979a-8edd989fffa4))
  (pad "26" smd rect (at -0.75 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp 87ca2347-9bf8-4fbf-8f8f-f0ca39ebd5c9))
  (pad "27" smd rect (at -1.25 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp a21bd5ce-a0f4-4126-9234-be4a3d2c4862))
  (pad "28" smd rect (at -1.75 -1.5625) (size 0.25 0.675) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0508) (tstamp fa41e6f1-2dc0-4c55-82ef-adacc33e436f))
)