WMS-job.gbrjob
{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "9.0.0"
    },
    "CreationDate": "2025-04-01T09:49:52+05:30"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "WMS",
      "GUID": "574d532e-6b69-4636-9164-5f7063625858",
      "Revision": "rev?"
    },
    "Size": {
      "X": 80.55,
      "Y": 59.05
    },
    "LayerNumber": 2,
    "BoardThickness": 1.6,
    "Finish": "None"
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 0.1683,
      "PadToTrack": 0.1683,
      "TrackToTrack": 0.1683,
      "MinLineWidth": 0.2
    }
  ],
  "FilesAttributes": [
    {
      "Path": "WMS-F_Silkscreen.gbr",
      "FileFunction": "Legend,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "WMS-B_Silkscreen.gbr",
      "FileFunction": "Legend,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "WMS-F_Fab.gbr",
      "FileFunction": "AssemblyDrawing,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "WMS-B_Fab.gbr",
      "FileFunction": "AssemblyDrawing,Bot",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "F.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 1.51,
      "Material": "FR4",
      "Name": "F.Cu/B.Cu",
      "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "B.Cu"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}