Files
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LemaireRomainEx1 / Exercice1_Lemaire_Romain.kicad_pcb
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LemaireRomainEx1 / Exercice1_Lemaire_Romain.kicad_sch
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Machine visualisation vibratoire / KiCad / _autosave-test.kicad_sch
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Machine visualisation vibratoire / KiCad / Arduino_UNO.kicad_sch
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Machine visualisation vibratoire / KiCad / Machine visualisation vibratoire correction.kicad_pcb
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Machine visualisation vibratoire / KiCad / Machine visualisation vibratoire.kicad_pcb
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Machine visualisation vibratoire / KiCad / Machine visualisation vibratoire.kicad_sch
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Machine visualisation vibratoire / KiCad / PAM8610.kicad_sch
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Machine visualisation vibratoire / KiCad / test.kicad_sch
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Machine visualisation vibratoire / KiCad / untitled.kicad_sch
Last update 1 week 1 day
by
AntoineZampunieris
Machine visualisation vibratoire-job.gbrjob{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "8.0.5" }, "CreationDate": "2024-11-08T18:49:46+01:00" }, "GeneralSpecs": { "ProjectId": { "Name": "Machine visualisation vibratoire", "GUID": "4d616368-696e-4652-9076-697375616c69", "Revision": "rev?" }, "Size": { "X": 151.55, "Y": 100.55 }, "LayerNumber": 4, "BoardThickness": 1.6, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.06, "PadToTrack": 0.06, "TrackToTrack": 0.06, "MinLineWidth": 0.2, "TrackToRegion": 0.75, "RegionToRegion": 0.75 }, { "Layers": "Inner", "PadToPad": 0.06, "PadToTrack": 0.06, "TrackToTrack": 0.06, "MinLineWidth": 0.2 } ], "FilesAttributes": [ { "Path": "Machine visualisation vibratoire-F_Cu.gtl", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-In1_Cu.g2", "FileFunction": "Copper,L2,Inr", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-In2_Cu.g3", "FileFunction": "Copper,L3,Inr", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-B_Cu.gbl", "FileFunction": "Copper,L4,Bot", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-F_Paste.gtp", "FileFunction": "SolderPaste,Top", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-B_Paste.gbp", "FileFunction": "SolderPaste,Bot", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-F_Silkscreen.gto", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-B_Silkscreen.gbo", "FileFunction": "Legend,Bot", "FilePolarity": "Positive" }, { "Path": "Machine visualisation vibratoire-F_Mask.gts", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "Machine visualisation vibratoire-B_Mask.gbs", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "Machine visualisation vibratoire-Edge_Cuts.gm1", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Top Solder Mask" }, { "Type": "Copper", "Thickness": 0.035, "Name": "F.Cu" }, { "Type": "Dielectric", "Thickness": 0.1, "Material": "FR4", "Name": "F.Cu/In1.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "In1.Cu" }, { "Type": "Dielectric", "Thickness": 1.24, "Material": "FR4", "Name": "In1.Cu/In2.Cu", "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "In2.Cu" }, { "Type": "Dielectric", "Thickness": 0.1, "Material": "FR4", "Name": "In2.Cu/B.Cu", "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "B.Cu" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }