MOLEX_105164-0001.kicad_mod
(footprint "MOLEX_105164-0001" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (property "Sheetfile" "payload_board.kicad_sch")
  (property "Sheetname" "")
  (property "ki_keywords" "1051640001")
  (attr smd)
  (fp_text reference "J7" (at -1.508428 -7.35) (layer "F.SilkS")
      (effects (font (size 0.640183 0.640183) (thickness 0.15)))
    (tstamp 54e10238-d5d8-4a0a-b89a-9f7df6632321)
  )
  (fp_text value "Molex_Micro_USB" (at -0.0875 -5.65) (layer "F.Fab")
      (effects (font (size 0.640873 0.640873) (thickness 0.15)))
    (tstamp a32ef9e9-51bd-4c7b-8449-353bdb75db92)
  )
  (fp_line (start -4.1 -4.45) (end -3.48 -4.45)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp e0306bd1-1ea6-478b-a1c3-f34828a8e893))
  (fp_line (start -4.1 -2.92) (end -4.1 -4.45)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 5e9f4454-e2cb-4e69-b979-1dfbbb09ae1b))
  (fp_line (start -4.1 0) (end -3.4 0)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 83a3e094-e181-4921-8695-91e35691db02))
  (fp_line (start -1.3 0) (end 1.3 0)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 94c4f11c-30eb-4fde-9a64-8586e0a5762d))
  (fp_line (start 3.4 0) (end 4.1 0)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp ccf5f174-1556-4603-bbda-67b27bd92873))
  (fp_line (start 4.1 -4.45) (end 3.48 -4.45)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 569044c8-c84f-4bc4-ae0c-673d1a6d33db))
  (fp_line (start 4.1 -2.92) (end 4.1 -4.45)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp fb2d2abd-97d6-4f55-94cc-f74a1e5ce219))
  (fp_circle (center 1.3 -5.4) (end 1.4 -5.4)
    (stroke (width 0.2) (type solid)) (fill none) (layer "F.SilkS") (tstamp 2e337de9-9699-4ce3-aee0-cc320832c553))
  (fp_line (start -4.75 -5.05) (end 4.75 -5.05)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp dc40f590-c9d7-4aba-a9a5-05ef2ef3d0dc))
  (fp_line (start -4.75 0.95) (end -4.75 -5.05)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 0cd4ca22-3852-4559-bef8-b13d6cd9b0e9))
  (fp_line (start 4.75 -5.05) (end 4.75 0.95)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp ef322cb9-4ab3-45fc-b717-5a4b38afc434))
  (fp_line (start 4.75 0.95) (end -4.75 0.95)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp a459a625-2cbc-4a64-b937-27b0d5975db0))
  (fp_line (start -4.1 -4.45) (end 4.1 -4.45)
    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 3648ff71-c96c-4d2e-8e37-3139f4be5f1b))
  (fp_line (start -4.1 0.7) (end -4.1 -4.45)
    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp a7cd2ce3-e6bd-4f05-9849-f3252b9453e8))
  (fp_line (start 4.1 -4.45) (end 4.1 0.7)
    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp f8610add-6558-4440-9ae0-ce2c3f8d2c8d))
  (fp_line (start 4.1 0.7) (end -4.1 0.7)
    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 5c97e48b-2b93-4368-b0a3-8102082b4fb3))
  (fp_circle (center 1.3 -5.4) (end 1.4 -5.4)
    (stroke (width 0.2) (type solid)) (fill none) (layer "F.Fab") (tstamp c3de9843-6c1c-4f25-ae90-991fb718fade))
  (pad "1" smd rect (at 1.3 -4.11 90) (size 1.38 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp f41bdcbe-5ad6-48c0-93cc-c7ea1e4b385a))
  (pad "2" smd rect (at 0.65 -4.11 90) (size 1.38 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp 92091ee9-3baf-4d23-8728-991130c5615d))
  (pad "3" smd rect (at 0 -4.11 90) (size 1.38 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp ced94b37-5775-4bdf-9972-010b6f53763e))
  (pad "4" smd rect (at -0.65 -4.11 90) (size 1.38 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp aeeb7f48-32c8-460b-9912-4a2741d5a014))
  (pad "5" smd rect (at -1.3 -4.11 90) (size 1.38 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp 53b8ac08-d7b5-4522-9a2a-6dcc2513d917))
  (pad "SH1" thru_hole oval (at -3.95 -1.45) (size 1.208 2.416) (drill oval 0.7 1.3) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.0762) (tstamp 4ed3d881-147b-4ebf-a8b3-79494da58b5f))
  (pad "SH2" smd rect (at -2.4625 -3.75 90) (size 2.1 1.475) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp 0454ac03-31d1-45ed-8eac-ff3e0bc976ff))
  (pad "SH3" smd rect (at -0.9375 -1.45 90) (size 1.9 1.375) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp 93d6b5fb-0912-4e5a-ba8e-af35f276a3d0))
  (pad "SH4" smd rect (at 0.9375 -1.45 90) (size 1.9 1.375) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp 42c18aa3-3fee-48af-ae97-9fb5bd871078))
  (pad "SH5" smd rect (at 2.4625 -3.75 90) (size 2.1 1.475) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.0762) (tstamp f96b435b-49e3-474f-8960-359b8963a6bc))
  (pad "SH6" thru_hole oval (at 3.95 -1.45) (size 1.208 2.416) (drill oval 0.7 1.3) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.0762) (tstamp 4fb82c34-c527-4108-946c-b60681f1d26d))
)