ColdPlungeMain-drl.rpt
Drill report for ColdPlungeMain.kicad_pcb
Created on Tue 07 Nov 2023 06:39:05 PM EST

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  In1.Cu                    in1
    L3 :  In2.Cu                    in2
    L4 :  In3.Cu                    in3
    L5 :  In4.Cu                    in4
    L6 :  B.Cu                      back


Drill file 'ColdPlungeMain.drl' contains
    plated through holes:
    =============================================================
    T1  0.250mm  0.0098"  (173 holes)
    T2  0.400mm  0.0157"  (635 holes)
    T3  0.600mm  0.0236"  (8 holes)
    T4  1.000mm  0.0394"  (16 holes)
    T5  1.016mm  0.0400"  (26 holes)
    T6  1.300mm  0.0512"  (24 holes)
    T7  1.800mm  0.0709"  (24 holes)
    T8  2.125mm  0.0837"  (10 holes)
    T9  4.300mm  0.1693"  (1 hole)

    Total plated holes count 917


Not plated through holes are merged with plated holes
    unplated through holes:
    =============================================================
    T10  3.000mm  0.1181"  (1 hole)
    T11  4.300mm  0.1693"  (4 holes)

    Total unplated holes count 5