Wire-to-board 24AWG 4-Pin.kicad_mod
(footprint "Wire-to-board 24AWG 4-Pin" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (attr smd)
  (fp_text reference "REF**" (at 0 -0.5 unlocked) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.1)))
    (tstamp 924146f6-ab2c-4ab2-ab28-b92eac32ce71)
  )
  (fp_text value "Wire-to-board 24AWG 4-Pin" (at 0 1 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp dc859565-3c57-412d-a619-6794ca5a253f)
  )
  (fp_text user "${REFERENCE}" (at 0 2.5 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 251d3f7f-4622-4ba5-b0a1-5c63673def75)
  )
  (fp_line (start 1.7 -3.8) (end 2.2 -4.2)
    (stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp a27dd68e-aec8-4c90-8647-741b6a63b35c))
  (fp_line (start 2.2 -4.2) (end 2.2 -3.4)
    (stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp 59da8dfa-14d5-4ec6-a4ff-b986a6f6013b))
  (fp_line (start 2.2 -3.4) (end 1.7 -3.8)
    (stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp 13c9bf01-12e5-4839-b7cd-daae9d47b8d3))
  (pad "1" smd roundrect (at 0 -3.81) (size 2.286 1.524) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp ecd944e0-080b-41d7-8c80-8595b251bea1))
  (pad "2" smd roundrect (at 0 -1.27) (size 2.286 1.524) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp 11c0479b-8d1c-4e35-9b2c-6f604b041f0c))
  (pad "3" smd roundrect (at 0 1.27) (size 2.286 1.524) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp c73f25ad-10af-4b74-910e-1aeef8588e2b))
  (pad "4" smd roundrect (at 0 3.81) (size 2.286 1.524) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp d89ff134-0fb5-4391-8cc3-3c6122d1c9fa))
)