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Last update 4 years 5 months
by Dominik Sliwa
sdrewire-job.gbrjob{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "5.99.0-unknown-r23941-4f651901" }, "CreationDate": "2020-11-30T00:39:08+01:00" }, "GeneralSpecs": { "ProjectId": { "Name": "sdrewire", "GUID": "73647265-7769-4726-952e-6b696361645f", "Revision": "rev?" }, "Size": { "X": 50.31, "Y": 23.7 }, "LayerNumber": 4, "BoardThickness": 0.8, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.095, "PadToTrack": 0.095, "TrackToTrack": 0.095, "MinLineWidth": 0.1, "TrackToRegion": 0.15, "RegionToRegion": 0.15 }, { "Layers": "Inner", "PadToPad": 0.0, "PadToTrack": 0.0, "TrackToTrack": 0.095, "MinLineWidth": 0.2, "TrackToRegion": 0.15, "RegionToRegion": 0.15 } ], "FilesAttributes": [ { "Path": "sdrewire-F_Cu.gbr", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "sdrewire-In1_Cu.gbr", "FileFunction": "Copper,L2,Inr", "FilePolarity": "Positive" }, { "Path": "sdrewire-In2_Cu.gbr", "FileFunction": "Copper,L3,Inr", "FilePolarity": "Positive" }, { "Path": "sdrewire-B_Cu.gbr", "FileFunction": "Copper,L4,Bot", "FilePolarity": "Positive" }, { "Path": "sdrewire-F_Paste.gbr", "FileFunction": "SolderPaste,Top", "FilePolarity": "Positive" }, { "Path": "sdrewire-F_Silkscreen.gbr", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "sdrewire-B_Silkscreen.gbr", "FileFunction": "Legend,Bot", "FilePolarity": "Positive" }, { "Path": "sdrewire-F_Mask.gbr", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "sdrewire-B_Mask.gbr", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "sdrewire-Edge_Cuts.gbr", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Color": "Green", "Thickness": 0.015, "Name": "Top Solder Mask" }, { "Type": "Copper", "Thickness": 0.035, "Name": "F.Cu" }, { "Type": "Dielectric", "Thickness": 0.1, "Material": "FR4", "Name": "F.Cu/In1.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)" }, { "Type": "Copper", "Thickness": 0.0175, "Name": "In1.Cu" }, { "Type": "Dielectric", "Thickness": 0.465, "Material": "FR4", "Name": "In1.Cu/In2.Cu", "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)" }, { "Type": "Copper", "Thickness": 0.0175, "Name": "In2.Cu" }, { "Type": "Dielectric", "Thickness": 0.1, "Material": "FR4", "Name": "In2.Cu/B.Cu", "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "B.Cu" }, { "Type": "SolderMask", "Color": "Green", "Thickness": 0.015, "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }