Files

RaspberryShield-job.gbrjob
{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "(6.0.9-0)" }, "CreationDate": "2022-11-14T23:33:27+01:00" }, "GeneralSpecs": { "ProjectId": { "Name": "RaspberryShield", "GUID": "52617370-6265-4727-9279-536869656c64", "Revision": "rev?" }, "Size": { "X": 40.1, "Y": 60.1 }, "LayerNumber": 2, "BoardThickness": 1.6, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.2, "PadToTrack": 0.2, "TrackToTrack": 0.2, "MinLineWidth": 0.5 } ], "FilesAttributes": [ { "Path": "RaspberryShield-F_Cu.gbr", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "RaspberryShield-B_Cu.gbr", "FileFunction": "Copper,L2,Bot", "FilePolarity": "Positive" }, { "Path": "RaspberryShield-F_Silkscreen.gbr", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "RaspberryShield-B_Silkscreen.gbr", "FileFunction": "Legend,Bot", "FilePolarity": "Positive" }, { "Path": "RaspberryShield-F_Mask.gbr", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "RaspberryShield-B_Mask.gbr", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "RaspberryShield-Edge_Cuts.gbr", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Name": "Top Solder Mask" }, { "Type": "Copper", "Name": "F.Cu" }, { "Type": "Dielectric", "Material": "FR4", "Name": "F.Cu/B.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" }, { "Type": "Copper", "Name": "B.Cu" }, { "Type": "SolderMask", "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }
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