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Last update 1 year 11 months by susanna-m-weber
Filescore_board
..
gerbers
buck_converter.kicad_sch
core_board-job.gbrjob
core_board.csv
core_board.kicad_pcb
core_board.kicad_prl
core_board.kicad_pro
core_board.kicad_sch
core_board.kicad_sch-bak
core_board.net
core_board.xml
fp-info-cache
fp-lib-table
sym-lib-table
core_board-job.gbrjob
{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "(6.0.1-0)" }, "CreationDate": "2022-10-17T14:17:14-07:00" }, "GeneralSpecs": { "ProjectId": { "Name": "core_board", "GUID": "636f7265-5f62-46f6-9172-642e6b696361", "Revision": "rev?" }, "Size": { "X": 355.7, "Y": 152.5 }, "LayerNumber": 4, "BoardThickness": 1.6, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.1524, "PadToTrack": 0.1524, "TrackToTrack": 0.254, "MinLineWidth": 0.254, "TrackToRegion": 0.254, "RegionToRegion": 0.254 }, { "Layers": "Inner", "PadToPad": 0.1524, "PadToTrack": 0.1524, "TrackToTrack": 0.254, "MinLineWidth": 1.016, "TrackToRegion": 0.508, "RegionToRegion": 0.508 } ], "FilesAttributes": [ { "Path": "core_board-F_Cu.gbr", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "core_board-In1_Cu.gbr", "FileFunction": "Copper,L2,Inr", "FilePolarity": "Positive" }, { "Path": "core_board-In2_Cu.gbr", "FileFunction": "Copper,L3,Inr", "FilePolarity": "Positive" }, { "Path": "core_board-B_Cu.gbr", "FileFunction": "Copper,L4,Bot", "FilePolarity": "Positive" }, { "Path": "core_board-F_Paste.gbr", "FileFunction": "SolderPaste,Top", "FilePolarity": "Positive" }, { "Path": "core_board-B_Paste.gbr", "FileFunction": "SolderPaste,Bot", "FilePolarity": "Positive" }, { "Path": "core_board-F_Silkscreen.gbr", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "core_board-B_Silkscreen.gbr", "FileFunction": "Legend,Bot", "FilePolarity": "Positive" }, { "Path": "core_board-F_Mask.gbr", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "core_board-B_Mask.gbr", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "core_board-Edge_Cuts.gbr", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Top Solder Mask" }, { "Type": "Copper", "Thickness": 0.035, "Name": "F.Cu" }, { "Type": "Dielectric", "Thickness": 0.48, "Material": "FR4", "Name": "F.Cu/In1.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "In1.Cu" }, { "Type": "Dielectric", "Thickness": 0.48, "Material": "FR4", "Name": "In1.Cu/In2.Cu", "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "In2.Cu" }, { "Type": "Dielectric", "Thickness": 0.48, "Material": "FR4", "Name": "In2.Cu/B.Cu", "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "B.Cu" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }

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rtd_board.kicad_pcb
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core_board / core_board.kicad_pcb
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