Optimised Product Design / Test - History

QoL Quality of Life changes:
added extra readme titleblock space
added customer logo part
arrange BOM order in schematic symbol fields table
added GND test point styles (hole and pad)
reduced soldermask expansion from 0.065mm to 0.05mm
changed copper-to-hole from 0.5mm to 0.35mm
removed 0.5/0.9mm via size
adjusted teardrop rules to better sizes
update library reference

updated kicad to v8.0.1 and re-saved
(intermediate v7.0.11 update didn't change anything)

added default TG135 PCB FR4 spec for 135C glass transition temp

named pcb ground planes
added schematic dashed circuit block bbounding box
updated library ref for heatsink/solid centre pads
**WIP** added useful custom DRC rules...
...note, pending question on crash issue

updated page dates, re-netlisted
edited and saved schematic & layout settings
set min connection (new DRC to 0.2mm same as min gap)
set min mask to copper as 0.05mm (new DRC)

****Convert v7 KiCAD format for template kicad project...
...simply opened & re-saved schematic & layout
...also update libraries to use KiCAD v7 converted

changed default dimension text to 2dp (was 4dp)
changed default dimension arrow to 1.0mm (was 1.27mm)
changed default dimension offset to 0mm (was 0.5mm)
updated to latest library version

added author/reviewer name placeholder text to pcb titleblock

added Fiducials FID1-6 using new library part...
...3off top, 3off bottom, 1mm/3mm mask default but 2mm available
...annotated, netlisted, placed in PCB
updated library ref for latest