HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias.kicad_mod
(module HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias (layer F.Cu) (tedit 5BD22035)
  (descr "HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
  (tags "HSOP SO")
  (attr smd)
  (fp_text reference U20 (at -5 0.65 180) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TPS54340 (at 0 3.4) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.98 0.98) (thickness 0.15)))
  )
  (fp_line (start 3.7 -2.7) (end -3.7 -2.7) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.7 2.7) (end 3.7 -2.7) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.7 2.7) (end 3.7 2.7) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.7 -2.7) (end -3.7 2.7) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.95 -1.475) (end -0.975 -2.45) (layer F.Fab) (width 0.1))
  (fp_line (start -1.95 2.45) (end -1.95 -1.475) (layer F.Fab) (width 0.1))
  (fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.1))
  (fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.1))
  (fp_line (start -0.975 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.1))
  (fp_line (start -1.95 2.56) (end 1.95 2.56) (layer F.SilkS) (width 0.12))
  (fp_line (start -3.45 -2.56) (end 1.95 -2.56) (layer F.SilkS) (width 0.12))
  (pad 8 smd roundrect (at 2.65 -1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 7 smd roundrect (at 2.65 -0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 6 smd roundrect (at 2.65 0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 5 smd roundrect (at 2.65 1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -2.65 1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -2.65 0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -2.65 -0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 1 smd roundrect (at -2.65 -1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at 0.6 0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at 0.6 -0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at -0.6 0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at -0.6 -0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
  (pad 9 smd roundrect (at 0 0) (size 2.41 3.1) (layers B.Cu) (roundrect_rratio 0.103734))
  (pad 9 thru_hole circle (at 0.7 1.1) (size 0.5 0.5) (drill 0.3) (layers *.Cu))
  (pad 9 thru_hole circle (at -0.7 1.1) (size 0.5 0.5) (drill 0.3) (layers *.Cu))
  (pad 9 thru_hole circle (at 0.7 0) (size 0.5 0.5) (drill 0.3) (layers *.Cu))
  (pad 9 thru_hole circle (at -0.7 0) (size 0.5 0.5) (drill 0.3) (layers *.Cu))
  (pad 9 thru_hole circle (at 0.7 -1.1) (size 0.5 0.5) (drill 0.3) (layers *.Cu))
  (pad 9 thru_hole circle (at -0.7 -1.1) (size 0.5 0.5) (drill 0.3) (layers *.Cu))
  (pad 9 smd roundrect (at 0 0) (size 2.41 3.1) (layers F.Cu F.Mask) (roundrect_rratio 0.103734))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.35x2.35mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)