Glasgow Embedded / Glasgow - History

revC2: Increased the solder paste apertures for paste in hole.

Extended the apertures for the USB-C and Tact switch shield through
holes. This should provide a bigger amount of solder for the through
holes. (Might require additional tweaking down the road)

revC2: Added copper fills to anchor the USB-C connector better.

Added copper flood fills on all PCB layers to make a more positive
anchor of the shield tab through holes to the PCB layers. Also enabled
solder paste aperture openings for the shield pads. Tested on other
projects I know that paste in hole works for these connectors.

revC2: Improved anchor of the tact switch shield to the PCB.

We now have through hole slots that will solder to the metal shield tabs
of the tact switch. This will securely anchor the tact switch to the
PCB.

revC2: Replaced top actuated tact switch with a side actuated one.

This should make the case design better. This is not necessarily the
final tact switch selection.

revC2: add more vias to layer changes of the main +5V rail

revC2: Added and assigned the UDFN-14 3d model for the IO ESD Diode packages.

revC1: Updated Placement plan.

Adjusted text sizes, and moved ID/Values to Fab layers.

revC2: Replaced 0603 HandSolder footprints with regular ones.