Glasgow Embedded / Glasgow - History

hardware: open & save with KiCAD 8.0.9

by Daniel O'Connor 2 months 4 weeks

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d884af4b

revC3: Added aluminium case outline with tolerance...

by esden 1 year 8 months

revC3: Added aluminium case outline with tolerance.

The case to board tolerance is 0.4mm. The lines are doubled to represent
the maximum overlap extents.

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562abd52

revC3: Marked non schematic/bom parts correctly.

by esden 1 year 8 months

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1fabd6f2

revC3: update fabrication layer text size/position...

by whitequark 1 year 8 months

revC3: update fabrication layer text size/position.

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a5ec2fbc

revC3: Final cleanups before production.

by esden 1 year 11 months

revC3: Final cleanups before production.

* Changed 3D models to step so the 3D model can be exported for
enclosure CAD.
* Changed silk and stop colors to match 1BitSquared production boards

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1b21bf7c

revC3: Corrected the USB-C 3D model position.

by esden 2 years 6 months

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23153b96

revC3: Added paste to USB-C shield anchors.

by esden 2 years 6 months

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2f9781df

revC3: Hid U12&U21 labels. Corrected APX 1b2 key.

by esden 2 years 6 months

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13a5ba7f

revC3: Increased Serial No frame size.

by esden 2 years 10 months

revC3: Increased Serial No frame size.

Now the frame is >6mm wide which will accomodate some more common label
printer labels without looking strange or oversized.

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80b30cec

revC3: Increased min pad gap to 0.22mm.

by esden 2 years 10 months

revC3: Increased min pad gap to 0.22mm.

This increases the chances of getting solder mask bridges between pads
decreasing probability of bridging.

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6ccf99ce