Files
-
hardware / rev0 / debug_control_connections.sch
-
hardware / rev0 / fpga_configuration.sch
-
hardware / rev0 / host_side.sch
-
hardware / rev0 / luna_rev0.kicad_pcb
-
hardware / rev0 / luna_rev0.sch
-
hardware / rev0 / power_supplies.sch
-
hardware / rev0 / ram_section.sch
-
hardware / rev0 / right_side_indicators.sch
-
hardware / rev0 / sideband_side.sch
-
hardware / rev0 / target_side.sch
Last update 5 years 4 months
by Kate Temkin
USB-MICROB-FCI-10103592-LONGPADS.kicad_mod(module USB-MICROB-FCI-10103592-LONGPADS (layer F.Cu) (tedit 5DAD30C7) (fp_text reference USB-MICROB-FCI-10103592-LONGPADS (at 2.49936 0) (layer F.SilkS) (effects (font (size 1.524 1.524) (thickness 0.3048))) ) (fp_text value VAL** (at 2.49936 0) (layer F.SilkS) hide (effects (font (size 1.524 1.524) (thickness 0.3048))) ) (fp_line (start 0 -2.825) (end 0 -4.75) (layer Cmts.User) (width 0.2032)) (fp_line (start 0 2.825) (end 0 4.75) (layer Cmts.User) (width 0.2032)) (fp_line (start 0 -2.825) (end 1.65 -2.825) (layer Cmts.User) (width 0.2032)) (fp_line (start 0 1.925) (end 1.65 1.925) (layer Cmts.User) (width 0.2032)) (fp_line (start 0 -1.925) (end 1.65 -1.925) (layer Cmts.User) (width 0.2032)) (fp_line (start 0 2.825) (end 1.65 2.825) (layer Cmts.User) (width 0.2032)) (fp_line (start 0 -1.925) (end 0 1.925) (layer Cmts.User) (width 0.2032)) (fp_arc (start 1.65 -2.375) (end 1.65 -2.825) (angle 180) (layer Cmts.User) (width 0.2032)) (fp_arc (start 1.65 2.375) (end 1.65 1.925) (angle 180) (layer Cmts.User) (width 0.2032)) (pad 6 thru_hole circle (at 4.73 2.49) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)) (pad 6 thru_hole circle (at 4.73 -2.49) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)) (pad 6 thru_hole circle (at 1.7 4.125) (size 1.5 1.5) (drill 0.9) (layers *.Cu *.Mask)) (pad 6 thru_hole circle (at 1.7 -4.125) (size 1.5 1.5) (drill 0.9) (layers *.Cu *.Mask)) (pad 6 smd rect (at 1.65 4) (size 2.1 1.75) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.05)) (pad 6 smd rect (at 1.65 -4) (size 2.1 1.75) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.05)) (pad 6 smd rect (at 3.075 2.9875) (size 1.35 1.825) (layers F.Cu F.Mask)) (pad 6 smd rect (at 3.075 -2.9875) (size 1.35 1.825) (layers F.Cu F.Mask)) (pad 6 smd rect (at 4.73 2.83) (size 1.46 2.14) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.05)) (pad 6 smd rect (at 4.73 -2.83) (size 1.46 2.14) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.05)) (pad 6 smd rect (at 1.45 0.9375) (size 2.5 1.375) (layers F.Cu F.Paste F.Mask)) (pad 6 smd rect (at 1.45 -0.9375) (size 2.5 1.375) (layers F.Cu F.Paste F.Mask)) (pad 1 smd rect (at 4.775 1.3) (size 2.25 0.4) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at 4.775 0.65) (size 2.25 0.4) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at 4.775 0) (size 2.25 0.4) (layers F.Cu F.Paste F.Mask)) (pad 4 smd rect (at 4.775 -0.65) (size 2.25 0.4) (layers F.Cu F.Paste F.Mask)) (pad 5 smd rect (at 4.775 -1.3) (size 2.25 0.4) (layers F.Cu F.Paste F.Mask)) )