Dennis Field / dvk-mx8m-bsb - History

Make some minor adjustments to the text positions on F.Fab and B.Fab

Adjustments on layers F.Fab and B.Fab to improve legibility:
- In case of a diode with diode symbol inside, the designator was moved outsided the component rectangle
- In case of text crossing the rectangle, the font size was reduced.
- 0402 components were not touched, the rectangle is sometimes crossing the first and last character of the text (still readable in most cases).

Bring back some of the copper zone pad connection settings specific to a per-footprint basis, remove the solderpaste from the pi-matching circuits

These settings were reset when all of the footprints were updated.

Lock all footprints and add PTN36043's SOT1442 3D model

Increase the track sizes for the smartcard and SIM card's VCC pins

Add silkscreen for the expected battery specs and the HKSs

Update the manufacturing files after the last several commits

Correct the fabrication note 4 now stating "see supplementary pdf" instead of "detail A", add RoHS mark on F.Silk layer

Increase various power-rated trace widths to being equal to the pad sizes they connect, make improvements to various power pin traces