Dennis Field / dvk-mx8m-bsb - History

Change the capacitor C1718 near the ETH PHY's AVDDL2 pin 44 from 220nF to 2.2uF

Emcraft is also going to change this cap to 2.2uF.

Now using GPIO5_IO03 (P4.03) to put the class-D op-amp in shutdown and conserve energy when muted, make C1716 near the ETH PHY's DVDDL pin 47 220nF instead of 10uF (EmCraft suggested that this should be 100nF but their's is 220nF, asked why), added a 10k pull-down to PAM2841's ENA pin, added a 100nF cap to the smart card's C1 VCC pin, added a 1uF cap to the haptic motor circuit's 3V3_P rail

Still need to use I2C3 instead of I2C1 according to EmCraft's suggestions.

Update the text-parsable PDF after the last several commits

PCB Layout: Movement of circuit blocks that partially dis-entangle airwires.
Beginning to route the connection from USB Hub IC to SD card (maybe too long distance for hi-speed SD Card access?)

Move the VBUS TVS diode and bypass caps and place copper pour on the respective pad areas, the VBUS rail has a 6mm wide fill zone in order to properly handle ~4.3A with a <10degreeC temperature rise (should also do this when bring VBUS to the charge controller), make the In4.Cu layer a solid ground layer

Move CAPTOUCH_~RST from BOOT_CFG_03 to GPIO1_IO05/P3.33 (was CSI_P2_PWDN), add a 10k pull-down to LCD_~RESET, make the corresponding changes to the BoM and netlist/layout

Having CAPTOUCH_~RST on BOOT_CFG_03 caused a voltage divider on the pin.

Small change in the (placeholder) antennae footprints.
Make the EDGE CUTS rectangle a real milling in the pcb.
(Only a memory aid that this is possible, also done inside the M.2 Cardholder footprint)

Update the BoM after adding the 1uF cap to the 2.8V LDO's EN pin

Route the PTC polyfuse that's on the VBUS rail using a copper pour on the In4.Cu layer, route the USB-C's shielding to parallel 0Ohm and NC cap to GND, add a power net class, add a 0.508mm annular ring 0.254mm drill via for power nets