Dennis Field / dvk-mx8m-bsb - History

Move the WLAN+BT M.2 sheet back to page 18 rather than the last page (24)

Update Bill-of-Materials format and include missing SEC1110 datasheet link, fixed lingering component properties typos

Add AC coupling caps to the HDMI_AUXP/N diff pair which were mistakenly left out, fix a couple typos/errors that were made when transitioning to the new top-leve sheet, make the M.2s' I2C RX TX hierarchical signals consistent and clearer

Hopefully all lingering errors have been caught, this will likely be the schematic commit that gets reviewed (fingers crossed).

Assign TLV3201AIDBVR footprint based on the SOT-23-5 official footprint using the given solder mask clearance and pad clearance parameters, assign the QFN48 3D model to the ETH PHY footprint, make some minor adjustments to the front sheet's layout

Create AP22814 footprint and assign it to the respective symbols, use DFN-6-1EP_2x2mm_Pitch0.65mm 3D module for AP22814

Move more symbols, sheets, and pins around on the front sheet to make it even clearer, bring back the old hierarchical structure (again), bring back each sheet's title, add large text "titles" to each sheet reflecting what they are for

Still need to double check everything on the first page.

Small visual enhancements on top level page - e. g. at least one grid space around schematic blocks.
Double-labelled I2C busses to indicate clearly that they are point-to-multipoint connections and not just point to point.
Reduced drawing field and logo a bit in size (saves space).

Make all sheets except the top-level one identical to master, also checkout master's dvk-mx8m-bsb-cache.lib file

Add GNSS antenna footprint including correct 50Ohm feed line dimensions and keepout area, add u-blox MAX-8 3D model, rename all instances of MAX-M8* to MAX-8* due to part selection, antenna feed line calculatos included (coplanar waveguide)

Need to add placeholder footprints for the other four antennae which will be represented as simple rectangular areas where the antennae will occupy. After that, all that is left is to assign the various remaining IC footprints and finally import all footprints into PCBNew & begin layout!

Assign jumper header footprints and component properties, selected based on required current rating and minimized area occupied, assigned 1.5mm diameter test points