Dennis Field / dvk-mx8m-bsb - History

Add FDV301N footprint based on the manufacturer's given recommended land pattern, use lower ESR 220uF tantalum capacitors in place of previously selected ones, re-export the BoM

Double checked FET footprints to make sure those assigned to the official SOT-23 footprint are correct.

Use the MIC5365-2.8YD5 SOT-23-5 package for the 2.8V rail (not the SC-70-5 2.85V LDO)

Add BLM18PG121SN1D chip ferrite beads to the GNSS, proximity+ambient light sensor, and IMU +3.3V power pins

Create PAM2841GR footprint and assign it, also assign its 3D model to KiCad's offical DFN-4 model, remove back solder mask to thermal relief vias on the footprints which have them, add thermal relief vias to the AR8031's exposed pad (EmCraft's baseboard has them)

Assign the FT440 footprint, assign it KiCad's offical SOT-23-5 3D model

Make use MIC5365's SC-70-5 package instead of the SOT-23-5 package since it is a lower cost and is more available, assign it the official SC-70-5 3D model

Used Microchip's "Package Specification" document which on page 41 shows the recommended land pattern for their SC-70-5 packages (nominal pad dimensions are given but spacing is shown as min/max, used these values +/- 0.05mm for headroom).

Create and assign the MIC5365-2.8YD5 footprint, using the official SOT-23-5 3D model

The MIC5365-2.8YD5's recommended land pattern in the datasheet has inconsistent dimensions, so reasonable values are used based on the given TSOT-23 package's dimensions and KiCad's official SOT-23-5 footprint.

Add MIC2876 5V boost converter's footprint, assign it, assign it the DFN-8 3D model

Create and assign RT8070 3.3V buck converter's footprint, import and assign its 3D model from the official KiCad repo