Torsten Martinsen / chairbot - Files

PowerIntegrations_eSOP-12B.kicad_mod
(module PowerIntegrations_eSOP-12B (layer F.Cu) (tedit 5A423863)
  (descr "eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf")
  (tags "Power Integrations K Package")
  (attr smd)
  (fp_text reference REF** (at 0 -6.1) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value PowerIntegrations_eSOP-12B (at 0 6.2) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -4.445 -4.08) (end -3.445 -5.08) (layer F.Fab) (width 0.1))
  (fp_line (start -6.8 -5.6) (end 6.8 -5.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start -6.8 5.6) (end -6.8 -5.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start 6.8 5.6) (end -6.8 5.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start 6.8 -5.6) (end 6.8 5.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start -4.445 -4.08) (end -4.445 5.08) (layer F.Fab) (width 0.1))
  (fp_line (start -4.445 5.08) (end 4.445 5.08) (layer F.Fab) (width 0.1))
  (fp_line (start 4.445 5.08) (end 4.445 -5.08) (layer F.Fab) (width 0.1))
  (fp_line (start 4.445 -5.08) (end -3.445 -5.08) (layer F.Fab) (width 0.1))
  (fp_line (start -4.445 5.2) (end 4.445 5.2) (layer F.SilkS) (width 0.12))
  (fp_line (start 4.445 -5.2) (end -6 -5.2) (layer F.SilkS) (width 0.12))
  (pad 13 smd rect (at 0 0 270) (size 8.15 5.51) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd oval (at 5.45 -4.45 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd oval (at 5.45 -2.67 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd oval (at 5.45 -0.89 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd oval (at 5.45 0.89 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd oval (at 5.45 2.67 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd oval (at 5.45 4.45 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd oval (at -5.45 4.45 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd oval (at -5.45 0.89 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd oval (at -5.45 -0.89 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd oval (at -5.45 -2.67 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd oval (at -5.45 -4.45 270) (size 0.71 1.7) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/PowerIntegrations_eSOP-12B.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)