Additional checks completed, and Gerbers exported for HQDFM. Looking good for manufacturing.

Optimisation complete.

Updated U1 footprint to better match the component we can order from Microchip.

Introduced new parts that can be purchased for manufacturing by NextPCB. Corrected numerous issues.

Completed layout for v2.

Moving thigns around.

Work in progress, new layout and routing.

Replaced USB C receptacle with a different model. Repositioning components to better align with manufacturer recommendations.

Completed draft of the layout.

Completed layout and 3D models, next up is review everything.