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Arnaud-Apu-Fanovard
Exo_1-job.gbrjob{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "8.0.5" }, "CreationDate": "2024-09-23T17:04:59+02:00" }, "GeneralSpecs": { "ProjectId": { "Name": "Exo_1", "GUID": "45786f5f-312e-46b6-9963-61645f706362", "Revision": "rev?" }, "Size": { "X": 75.9629, "Y": 34.5277 }, "LayerNumber": 2, "BoardThickness": 1.6, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.2, "PadToTrack": 0.2, "TrackToTrack": 0.2, "MinLineWidth": 0.2, "TrackToRegion": 0.5, "RegionToRegion": 0.5 } ], "FilesAttributes": [ { "Path": "Exo_1-F_Cu.gbr", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "Exo_1-B_Cu.gbr", "FileFunction": "Copper,L2,Bot", "FilePolarity": "Positive" }, { "Path": "Exo_1-F_Paste.gbr", "FileFunction": "SolderPaste,Top", "FilePolarity": "Positive" }, { "Path": "Exo_1-B_Paste.gbr", "FileFunction": "SolderPaste,Bot", "FilePolarity": "Positive" }, { "Path": "Exo_1-F_Silkscreen.gbr", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "Exo_1-B_Silkscreen.gbr", "FileFunction": "Legend,Bot", "FilePolarity": "Positive" }, { "Path": "Exo_1-F_Mask.gbr", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "Exo_1-B_Mask.gbr", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "Exo_1-Edge_Cuts.gbr", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Name": "Top Solder Mask" }, { "Type": "Copper", "Name": "F.Cu" }, { "Type": "Dielectric", "Material": "FR4", "Name": "F.Cu/B.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" }, { "Type": "Copper", "Name": "B.Cu" }, { "Type": "SolderMask", "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }