XBP9B-DMST-002_DIP2200W51P200L3294H279Q20P.kicad_mod
(footprint DIP2200W51P200L3294H279Q20P (layer F.Cu) (tedit 67662E95)
  (descr "")
  (fp_text reference REF** (at -13.672335 9.350525 900) (layer F.SilkS)
    (effects (font (size 1.00273228346 1.00273228346) (thickness 0.15)))
  )
  (fp_text value DIP2200W51P200L3294H279Q20P (at 13.63917 -4.15241 900) (layer F.Fab)
    (effects (font (size 1.00177952756 1.00177952756) (thickness 0.15)))
  )
  (pad 1 thru_hole rect (at -11.0 -8.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at -11.0 -6.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at -11.0 -4.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 4 thru_hole circle (at -11.0 -2.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 5 thru_hole circle (at -11.0 -0.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 6 thru_hole circle (at -11.0 1.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 7 thru_hole circle (at -11.0 3.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 8 thru_hole circle (at -11.0 5.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 9 thru_hole circle (at -11.0 7.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 10 thru_hole circle (at -11.0 9.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 11 thru_hole circle (at 11.0 9.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 12 thru_hole circle (at 11.0 7.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 13 thru_hole circle (at 11.0 5.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 14 thru_hole circle (at 11.0 3.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 15 thru_hole circle (at 11.0 1.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 16 thru_hole circle (at 11.0 -0.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 17 thru_hole circle (at 11.0 -2.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 18 thru_hole circle (at 11.0 -4.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 19 thru_hole circle (at 11.0 -6.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 20 thru_hole circle (at 11.0 -8.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (fp_line (start -4.6 -16.47) (end 4.6 -16.47) (layer F.SilkS) (width 0.2))
  (fp_line (start 12.19 -9.94) (end 12.19 16.47) (layer F.SilkS) (width 0.2))
  (fp_line (start 12.19 16.47) (end -12.19 16.47) (layer F.SilkS) (width 0.2))
  (fp_line (start -12.19 16.47) (end -12.19 -9.94) (layer F.SilkS) (width 0.2))
  (fp_line (start -12.19 -9.94) (end -4.6 -16.47) (layer F.SilkS) (width 0.2))
  (fp_line (start 12.19 -9.94) (end 4.6 -16.47) (layer F.SilkS) (width 0.2))
  (fp_line (start -12.5 16.75) (end -12.5 -10.0) (layer F.CrtYd) (width 0.05))
  (fp_line (start -12.5 -10.0) (end -4.75 -16.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start -4.75 -16.75) (end 4.75 -16.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start 4.75 -16.75) (end 12.5 -10.0) (layer F.CrtYd) (width 0.05))
  (fp_line (start 12.5 -10.0) (end 12.5 16.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start 12.5 16.75) (end -12.5 16.75) (layer F.CrtYd) (width 0.05))
  (model "${KICAD_3RD_PARTY}/Snapeda.3dshapes/XBP9B-DMST-002.step"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)