Update Pandoc and make CI fail on error in build.sh

Major update for BMS C1 v0.3 This commit contains major updates of the PCB after the first prototype build-up and testing. Changes include: - Single PCB instead of stacked PCBs to simplify design and reduce cost. - STM32 MCU was removed due to supply shortage. Only ESP32-C3 supported. - Custom connectors replaced with off-the-shelf Würth Power Elements. - 5V power rail removed to simplify design (CAN runs on 3V3 transceiver). - Larger Shunt with improved footprint. - Optimized layout to reduce distance between IC and shunt.

Updates based on review comments (v0.2) This is the design revision that was ordered for the first prototype build. The pinout of the cell connector and the board-to-board connector changed compared to v0.1, hence it got a minor revision update. The control board is now a 4-layer board to improve the grounding of the PCB. Various other suggested improvements from the design review are also included in this update. Fixes #11, #12, #13, #17, #18, #19

Add heat transfer calculation and assembly picture

Fix texlive in CI and add ibom to deployment

v0.1 design ready for review

WIP: Schematic almost finished

Update KiCad files based on spec updates

Update spec based on initial reviews and feedback - More common SMD shunt resistor (issue #2) - High current connection using custom busbar instead of expensive press-fit terminals (issue #3) - RJ45 connectors for CAN not on board anymore (issue #4)

First placement tests for spec document