Housekeeping update - 1.2.2
by Martin ROGER 2 years 1 month
Housekeeping update - 1.2.2

Version numbers updated to 1.2.2 for the schematic and PCB
Components identified, datasheet and descriptions updated
iBOM regenerated
PCB plots regenerated
PCB :
- only thermal reliefs on PTH, not on SMD pads
- couple GND islands taken care of
- couple rationalisations on the 3v3 rails
Updated 12V to 3V3
by Alex-XNR 2 years 1 month
Updated 12V to 3V3

Simplified 12V to 3V3 switcher
Squashed commit of the following:
by Alex-XNR 2 years 1 month
Squashed commit of the following:

commit 5d265e0e6d749114a68b27b45df218b106b0dda5
Author: Martin <martin.roger@me.com>
Date: Sun May 14 20:34:43 2023 +0200

PCB layout update 1.2.1

Updated with OpAmp circuitry plus some component identification

commit e510fc9f0677414791fc51d243bf00155fb26728
Author: Martin <martin.roger@me.com>
Date: Sun May 14 14:19:23 2023 +0200

Minor corrections

Some mistqkes in INO
Added the touch debug flag

commit 39b8eb1dd0c73808717710d3ae2345f3cfa5b5d1
Author: Martin <martin.roger@me.com>
Date: Fri May 12 23:38:18 2023 +0200

Minor SW release

- Added foundation functions and debug mode
- Renamed some ESP32 inputs
- Completed some SMD footprints that were missing

PCB update to be done

commit 08e3d1716bbe43949a4019fcee6763aea3e34f1a
Author: Martin <martin.roger@me.com>
Date: Fri May 12 21:53:42 2023 +0200

Set up the backdrop for the main app

commit c3ed86fce4fcb190438511655d11e34b93c4a6d7
Author: Martin <martin.roger@me.com>
Date: Sun May 7 20:18:31 2023 +0200

Fonts reshape

Stress testing might be a bit too stress intensive, so next stages are :
- [ ] Implementing quantization
- [ ] Implementing limited Serial traffic

commit 16192a15fbcd7a686e9e8305dc9c0428b85582b9
Author: Martin <martin.roger@me.com>
Date: Sun May 7 18:21:27 2023 +0200

Initial stress testing program running

A lot of segmentation on long progress bars doing fast sweeps (like RPM for example
No value-repetition check on maths that are being sent over
Monospaced fonts are a must

commit 4baf02bf7cf1927fa370c3b43206f2998dc5adb6
Author: Martin <martin.roger@me.com>
Date: Sun May 7 13:58:41 2023 +0200

HMIStressTest INO start

commit da31e5c56e9e0899be07c6d1a89f26ae126bc7fa
Author: Martin <martin.roger@me.com>
Date: Sun May 7 13:15:57 2023 +0200

Added HMI draft and prepared code for stress testing

commit 8402b0421a5d619076ddba386df9a0a7946e83b8
Author: Martin <martin.roger@me.com>
Date: Mon May 1 01:01:04 2023 +0200

Added PDF schematic for reference

commit 0abb7f70bfd32a1cf75c841c40817ddc2e84700f
Author: Martin <martin.roger@me.com>
Date: Mon May 1 00:49:05 2023 +0200

Added first draft of Op-amp based circuitry

Also some rationalisation of the components to avoid near-duplicates (e.g. 0.1uF 50V caps)
Continued merge of both branches
by Martin ROGER 2 years 2 months
Continued merge of both branches

Cleaned up PCB, extended 10mm to the right and pushed the power conversion stages to the right of the board.
Left Resistive sensors out in the open as they will be changed, increased available real estate for resistive sensor
1.1HW and Schematics -> PR
by Martin ROGER 2 years 2 months
1.1HW and Schematics -> PR

- Updated all dates in title blocks
- Added both FET based new power supply and protection circuits - completely winged the zones
- Completed PCB layout, passes DRCs --> Needs review
- Updated PCB metadata
- Relocated 5th mounting hole a bit
- Regenerated interactive BOM
Power conversion split, work prep
by Martin 2 years 2 months
Power conversion split, work prep

-3V3 supply now in parallel with 5V stage
- Reorganisation of hierarchical sheets
- WaterT sense is indeed a PWM so is singled out in the hierarchical sheet
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