Reverted GND plane thermal reliefs Everyone gets thermal reliefs... you get thermal reliefs, YOU GET THERMAL RELIEFS !

Housekeeping update - 1.2.2 Version numbers updated to 1.2.2 for the schematic and PCB Components identified, datasheet and descriptions updated iBOM regenerated PCB plots regenerated PCB : - only thermal reliefs on PTH, not on SMD pads - couple GND islands taken care of - couple rationalisations on the 3v3 rails

GND fill thermal reliefs Changed the GND plane fill to thermal relief to aid manufacture

PCB update Includes 12V switcher updates plus other tweaks and additional ground stitching

Minor PCB changes

Squashed commit of the following: commit 5d265e0e6d749114a68b27b45df218b106b0dda5 Author: Martin Date: Sun May 14 20:34:43 2023 +0200 PCB layout update 1.2.1 Updated with OpAmp circuitry plus some component identification commit e510fc9f0677414791fc51d243bf00155fb26728 Author: Martin Date: Sun May 14 14:19:23 2023 +0200 Minor corrections Some mistqkes in INO Added the touch debug flag commit 39b8eb1dd0c73808717710d3ae2345f3cfa5b5d1 Author: Martin Date: Fri May 12 23:38:18 2023 +0200 Minor SW release - Added foundation functions and debug mode - Renamed some ESP32 inputs - Completed some SMD footprints that were missing PCB update to be done commit 08e3d1716bbe43949a4019fcee6763aea3e34f1a Author: Martin Date: Fri May 12 21:53:42 2023 +0200 Set up the backdrop for the main app commit c3ed86fce4fcb190438511655d11e34b93c4a6d7 Author: Martin Date: Sun May 7 20:18:31 2023 +0200 Fonts reshape Stress testing might be a bit too stress intensive, so next stages are : - [ ] Implementing quantization - [ ] Implementing limited Serial traffic commit 16192a15fbcd7a686e9e8305dc9c0428b85582b9 Author: Martin Date: Sun May 7 18:21:27 2023 +0200 Initial stress testing program running A lot of segmentation on long progress bars doing fast sweeps (like RPM for example No value-repetition check on maths that are being sent over Monospaced fonts are a must commit 4baf02bf7cf1927fa370c3b43206f2998dc5adb6 Author: Martin Date: Sun May 7 13:58:41 2023 +0200 HMIStressTest INO start commit da31e5c56e9e0899be07c6d1a89f26ae126bc7fa Author: Martin Date: Sun May 7 13:15:57 2023 +0200 Added HMI draft and prepared code for stress testing commit 8402b0421a5d619076ddba386df9a0a7946e83b8 Author: Martin Date: Mon May 1 01:01:04 2023 +0200 Added PDF schematic for reference commit 0abb7f70bfd32a1cf75c841c40817ddc2e84700f Author: Martin Date: Mon May 1 00:49:05 2023 +0200 Added first draft of Op-amp based circuitry Also some rationalisation of the components to avoid near-duplicates (e.g. 0.1uF 50V caps)

Continued merge of both branches Cleaned up PCB, extended 10mm to the right and pushed the power conversion stages to the right of the board. Left Resistive sensors out in the open as they will be changed, increased available real estate for resistive sensor

Consolidated merges

PCB updates for power input and 5V regulator Updated footprints and PCB layout for new power input and modified 5V switching regulator.

Power conversion split, work prep -3V3 supply now in parallel with 5V stage - Reorganisation of hierarchical sheets - WaterT sense is indeed a PWM so is singled out in the hierarchical sheet