UP Module with fused IOs: alpha version routing of a version with max. IOs / functions fitting on a single PCB for in-wall installation done. Parts size 0805.

Update of UP Module with fused IOs Completely changed how IOs will be protected. EEPROM and cropty IC added.

New UP Module with fused IOs Initial commit of new in wall module with as many IOs as possible. New PCB size for solid walls and dry construction. Work in progress.