Optimised Product Design / Test - History

QoL Quality of Life changes:
added extra readme titleblock space
added customer logo part
arrange BOM order in schematic symbol fields table
added GND test point styles (hole and pad)
reduced soldermask expansion from 0.065mm to 0.05mm
changed copper-to-hole from 0.5mm to 0.35mm
removed 0.5/0.9mm via size
adjusted teardrop rules to better sizes
update library reference

update fp-lib-table, fixes modules.pretty error
updaed library ref to latest

updated kicad libraries to latest incl 2025 copyright date

updated library link after libraries updated to v8.0.1

updated kicad to v8.0.1 and re-saved
(intermediate v7.0.11 update didn't change anything)

added default TG135 PCB FR4 spec for 135C glass transition temp

added default part field names to project
updated library ref to latest

updated library to latest
renames symbol library ic-microcontroller to ic-processor
adds modules-plugin symbol library

added DRC rule to stop vias in SMD pads...
...other custom DRC rule from v7.0.0 release notes
...also resolved DRC crash issue (fixed in v7.0.7)
added comments to clarify first rule is not a DRC!...
...also removed severity, not used here.