FMC_Fanout.pro
update=10/02/2021 17:27:6
version=1
last_client = kicad
[general]
version=1
RootSch=
BoardNm=
[cvpcb]
version=1
netIExt=net
[eeschema]
version=1
LibDir=
[eeschema/libraries]
[schematic_editor]
version=1
PageLayoutDescrFile=
PlotDirectoryName=C:\Users\dbaudin\Documents_Local\Projet\BINGO\Implementation\Electronic\FMC_Extension/0001/Doc/Schematic
SubpartIdSeparator=0
SubpartFirstId=65
NetFmtName=Pcbnew
SpiceAjustPassiveValues=0
LabSize=50
ERC_TestSimilarLabels=1
[pcbnew]
version=1
PageLayoutDescrFile=
LastNetListRead=
CopperLayerCount=6
BoardThickness=1.6
AllowMicroVias=0
AllowBlindVias=0
RequireCourtyardDefinitions=0
ProhibitOverlappingCourtyards=1
MinTrackWidth=0.15
MinViaDiameter=0.35
MinViaDrill=0.1
MinMicroViaDiameter=0.2
MinMicroViaDrill=0.1
MinHoleToHole=0.25
[pcbnew/Netclasses]
[pcbnew/Netclasses/Default]
Name=Default
Clearance=0.15
TrackWidth=0.15
ViaDiameter=0.35
ViaDrill=0.1
uViaDiameter=0.2
uViaDrill=0.1
dPairWidth=0.15
dPairGap=0.15
dPairViaGap=0.5
SilkLineWidth=0.12
SilkTextSizeV=1
SilkTextSizeH=1
SilkTextSizeThickness=0.15
SilkTextItalic=0
SilkTextUpright=1
CopperLineWidth=0.2
CopperTextSizeV=1.5
CopperTextSizeH=1.5
CopperTextThickness=0.3
CopperTextItalic=0
CopperTextUpright=1
EdgeCutLineWidth=0.05
CourtyardLineWidth=0.05
OthersLineWidth=0.15
OthersTextSizeV=1
OthersTextSizeH=1
OthersTextSizeThickness=0.15
OthersTextItalic=0
OthersTextUpright=1
SolderMaskClearance=0.05
SolderMaskMinWidth=0
SolderPasteClearance=0
SolderPasteRatio=-0
[pcbnew/Layer.F.Cu]
Name=F.Cu
Type=0
Enabled=1
[pcbnew/Layer.In1.Cu]
Name=In1.Cu
Type=0
Enabled=1
[pcbnew/Layer.In2.Cu]
Name=In2.Cu
Type=0
Enabled=1
[pcbnew/Layer.In3.Cu]
Name=In3.Cu
Type=0
Enabled=1
[pcbnew/Layer.In4.Cu]
Name=In4.Cu
Type=0
Enabled=1
[pcbnew/Layer.B.Cu]
Name=B.Cu
Type=0
Enabled=1