Glasgow Embedded / Glasgow - History

revC3: export fabrication files.

by whitequark 1 year 8 months

revC3: export fabrication files.

Except for BOM.

Changes

Files

1330f6d9

revC3: update fabrication layer text size/position...

by whitequark 1 year 8 months

revC3: update fabrication layer text size/position.

Changes

Files

a5ec2fbc

revC3: Corrected U2 (CAT24M01) part number.

by esden 1 year 11 months

Changes

Files

e90ca13b

revC3: Final cleanups before production.

by esden 1 year 11 months

revC3: Final cleanups before production.

* Changed 3D models to step so the 3D model can be exported for
enclosure CAD.
* Changed silk and stop colors to match 1BitSquared production boards

Changes

Files

1b21bf7c

Added null logo footprints to local library.

by esden 1 year 11 months

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92a07ae5

revC3: Corrected the USB-C 3D model position.

by esden 2 years 6 months

Changes

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23153b96

revC3: Added paste to USB-C shield anchors.

by esden 2 years 6 months

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Files

2f9781df

revC3: Hid U12&U21 labels. Corrected APX 1b2 key.

by esden 2 years 6 months

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Files

13a5ba7f

revC3: Increased Serial No frame size.

by esden 2 years 10 months

revC3: Increased Serial No frame size.

Now the frame is >6mm wide which will accomodate some more common label
printer labels without looking strange or oversized.

Changes

Files

80b30cec

revC3: Increased min pad gap to 0.22mm.

by esden 2 years 10 months

revC3: Increased min pad gap to 0.22mm.

This increases the chances of getting solder mask bridges between pads
decreasing probability of bridging.

Changes

Files

6ccf99ce