Glasgow Embedded / Glasgow - History

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    revC3: export fabrication files.
    by whitequark 2 years 2 months
    revC3: export fabrication files.

    Except for BOM.
    Changes
    Files
    1330f6d9
    revC3: update fabrication layer text size/position...
    by whitequark 2 years 2 months
    revC3: update fabrication layer text size/position.
    Changes
    Files
    a5ec2fbc
    revC3: Corrected U2 (CAT24M01) part number.
    by esden 2 years 4 months
    Changes
    Files
    e90ca13b
    revC3: Final cleanups before production.
    by esden 2 years 4 months
    revC3: Final cleanups before production.

    * Changed 3D models to step so the 3D model can be exported for
    enclosure CAD.
    * Changed silk and stop colors to match 1BitSquared production boards
    Changes
    Files
    1b21bf7c
    Added null logo footprints to local library.
    by esden 2 years 4 months
    Changes
    Files
    92a07ae5
    revC3: Corrected the USB-C 3D model position.
    by esden 3 years 1 week
    Changes
    Files
    23153b96
    revC3: Added paste to USB-C shield anchors.
    by esden 3 years 1 week
    Changes
    Files
    2f9781df
    revC3: Hid U12&U21 labels. Corrected APX 1b2 key.
    by esden 3 years 1 week
    Changes
    Files
    13a5ba7f
    revC3: Increased Serial No frame size.
    by esden 3 years 3 months
    revC3: Increased Serial No frame size.

    Now the frame is >6mm wide which will accomodate some more common label
    printer labels without looking strange or oversized.
    Changes
    Files
    80b30cec
    revC3: Increased min pad gap to 0.22mm.
    by esden 3 years 3 months
    revC3: Increased min pad gap to 0.22mm.

    This increases the chances of getting solder mask bridges between pads
    decreasing probability of bridging.
    Changes
    Files
    6ccf99ce
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