Glasgow Embedded / Glasgow - History

test-jig: reduce space needed for testpoints and solderjumper

- use smaller solderjumpers footprints
- 2 solderjumpers for I2C address selection instead of solderjumper + testpoint
- smaller testpoint footprints

test-jig: re-orient some of the connectors to better match the intended layout

test-jig: use smaller footprints for '4066 and '2G14

test-jig: add terminal block footprint (Metz AST04106) and assign it

test-jig: assign footprints (except terminals to pogo pins)

test-jig schematics: change from start button to a power switch with autodetect

Powering off the jig & dut will prevent any glitches due to contact bounce and similar effects.

test-jig schematics: increase resistance of local i2c pullups to 22k

4k7 might conflict with the max allowed current of some components on Glasgow.
It is a tradeoff against contact bounce when connecting the board, so do not increase
the value too much.