revC2: Updated UDFN-18 to roundrect pads.

revC2: Updated TSSOP footprint to get roundrect pads.

revC2: Replaced rpack8->4 and level shifter package. * The 8x resistor arrays are not as common as 4x. Thus the 8x end up being more expensive and harder to source. * The SOT-563 package has slightly harder to solder than the SOT-363. Also the level shifter in SOT-363 is lower cost.

revC2: Updated a bunch of the footprints to the upstream versions. This change seems like a big diff but it only really changes SOIC-8 and MSOP-8. They mostly bring roundrect changes and increase pad length for better fileting.

revC2: Updated the VREG DFN Footprints to match datasheet. The datasheet has a finer footprint with smaller pads and smaller Via drills.

revC2: Changed SOT-563 footprint to improve assembly reliability. The previous footprint was causing the solder stop webbing to be very thin which can result in the webbing missing on PCBs and result in shorts during reflow.

revC2: Bump revision. Remove ESD diode ground pads. The main reason to remove the ground pads is assembly reliability. In previous boards it was observed that it is fairly easy to create shorts between the ground pads and signal pads of the package.

revC1: update PCB from schematic (fix regulator values)

revC1: hide 1V2 label from B.Fab layer

revC1: move caution text closer to board makes it center more nicely in fab output