Glasgow Embedded / Glasgow - History

revC2: All swapped all remaining missing roundrect footprints.

All footprints that are still not roundrect in the official KiCad
library moved to local Glasgow footprint library and updated to
roundrect pads.

Also made a version of the 2x22 pin 1.27mm pitch LVDS connector with
alignment pins. This will allow us to have accurate enough position of
the connector so we can reliably connect to it in the pogopin tester and
to possible daugter boards.

revC2: Replaced rpack8->4 and level shifter package.

* The 8x resistor arrays are not as common as 4x. Thus the 8x end up being
more expensive and harder to source.
* The SOT-563 package has slightly harder to solder than the SOT-363.
Also the level shifter in SOT-363 is lower cost.

revC2: Updated a bunch of the footprints to the upstream versions.

This change seems like a big diff but it only really changes SOIC-8 and
MSOP-8. They mostly bring roundrect changes and increase pad length for
better fileting.

revC2: Updated the VREG DFN Footprints to match datasheet.

The datasheet has a finer footprint with smaller pads and smaller Via
drills.

revC2: Changed SOT-563 footprint to improve assembly reliability.

The previous footprint was causing the solder stop webbing to be very
thin which can result in the webbing missing on PCBs and result in
shorts during reflow.

revC2: Bump revision. Remove ESD diode ground pads.

The main reason to remove the ground pads is assembly reliability. In
previous boards it was observed that it is fairly easy to create shorts
between the ground pads and signal pads of the package.

revC1: update PCB from schematic (fix regulator values)