Dennis Field / dvk-mx8m-bsb - History

refined camera connector footprint
added drawing sheet for pcb with board dimensions

Add EmCraft's i.MX 8M System-on-Module 3D model and assign it to the respective footprints

The offset from the main-board to the SoM was measured to be very close to 4.0mm by adjusting the offset and double checking the spacing, it should be fairly accurate when determining the amount of space available (some double checking required).

Create PAM2841GR footprint and assign it, also assign its 3D model to KiCad's offical DFN-4 model, remove back solder mask to thermal relief vias on the footprints which have them, add thermal relief vias to the AR8031's exposed pad (EmCraft's baseboard has them)

Assign the FT440 footprint, assign it KiCad's offical SOT-23-5 3D model

Make use MIC5365's SC-70-5 package instead of the SOT-23-5 package since it is a lower cost and is more available, assign it the official SC-70-5 3D model

Used Microchip's "Package Specification" document which on page 41 shows the recommended land pattern for their SC-70-5 packages (nominal pad dimensions are given but spacing is shown as min/max, used these values +/- 0.05mm for headroom).

Create and assign the MIC5365-2.8YD5 footprint, using the official SOT-23-5 3D model

The MIC5365-2.8YD5's recommended land pattern in the datasheet has inconsistent dimensions, so reasonable values are used based on the given TSOT-23 package's dimensions and KiCad's official SOT-23-5 footprint.

Add MIC2876 5V boost converter's footprint, assign it, assign it the DFN-8 3D model