Dennis Field / dvk-mx8m-bsb - History

Changes in library symbol and footprint of J1503 (micro-SIM-connector). Differences prevented real connections of footprint pads.

Center the GNSS chip antenna on it's footprint design to make sure it's component coordinates are correct, add WLAN+BT placeholder footprint which is identical to the GNSS one (still needs to be selected)

The WWAN/BB chip antenna is likely going to be significantly different than the GNSS one (in terms of design and area) so it is not currently being used as a placeholder for it.

Create SN74LVC1G332DCKR footprint based on the manufacturer's given example and assign it to the respective schematic symbol, assign it the official KiCad SC-70-6 3D model

Create and assign SEC1110's footprint, assign it KiCad's offical QFN-16-1EP_5x5mm_Pitch0.8mm 3D model

Create FSA6157L6X footprint, import and assign its MO-255 3D model

Create SGTL5000XNLA3R2 footprint and assign it KiCad's official UQFN-20-1EP_3x3mm_Pitch0.4mm 3D model

Use LSM9DS1 manufacturer's recommended land and solder mask design pattern, include silkscreen notes on the axis directions, import LGA24 3D model and assign it

Use manufacturer's layout pad information for the VCNL4040 (U2001) footprint

Need to know which specific part number was ordered, potentially making the current one incorrect (was it the VCNL4040M3OE-H5?).

Create the NTB0104GU12 footprint based on the manufacturer's given recommended reflow soldering footprint and assign it to the respective symbols