Dennis Field / dvk-mx8m-bsb - History

Add 0.3mm diameter thermal relief via to the AP22814 footprint's exposed pad

Add silkscreen dot to all footprints which are missing one that need them to determine IC orientation

Update MX25L1606EZNI's land pattern reference page to being 56 instead of 4

MX25L1606EZNI's land description explicitly states "Avoid placing vias or traces underneath the metal pad." This means that the exposed pad will need to be connected to ground through the top layer (and vias in other locations on the board, not at the exposed pad).

Add FDV301N footprint based on the manufacturer's given recommended land pattern, use lower ESR 220uF tantalum capacitors in place of previously selected ones, re-export the BoM

Double checked FET footprints to make sure those assigned to the official SOT-23 footprint are correct.

Include silkscreen reference designator in the MHF4 footprint

Make LEDK on the dsi.sch sheet a hierarchical OUTPUT pin

Add orientation silkscreen dot to the MAX-M8 footprint

Add orientation silkscreen info to the VCNL4040 footprint, import its 3D model

The 3D model is actually associated with the narrower package and can be considered a temporary placeholder.

Add thermal relief vias to the PTN5110 footprint's exposed pad and adjust the solder paste dimensions