Dennis Field / dvk-mx8m-bsb - History

Replace the VCNL4040 proximity+ambient light sensor's 470nF bypass cap on VDD with a 1uF one to reduce the number of BoM line items, also replace the USB Hub+SDIO bridge chip's SDCD cap between the P-MOSFET's gate and drain with an 18pF capacitor instead of a 10pF for the same reason (reduce number of BoM line items)

Add 18pF capacitor to WLAN+BT M.2 circuit as is done on the WWAN bypass cap array

Make some minor fixes to various components' properties and update the BoM with the respective changes, sort the BoM based on reference designator and value

Replace SZMM5Z3V3T1G with MMSZ4688 zener diode which has a higher reverse working voltage to ensure that HP_DET is at a strong HIGH level when headphones/headset are inserted into the jack, replace its SOD-523 footprint with the corresponding SOD-123 footprint from the spec sheet's recommended land pattern

Add pin 1 indicator and silkscreen boarder to the SoM connector footprint, apply the respective change to the layout

Move the SoM onto the center of the board and place its connectors in the corresponding locations

Apply the last commit's changes to the SoM footprint in the layout