Dennis Field / dvk-mx8m-bsb - History

Update WWAN mPCIe sheet by organizing a few things and fixing the component properties order

Replace WWAN M.2 circuit with one intended for mPCIe modules, include 74LVC1G08 single 2-input AND gate, create the AND gate's footprint and use the official SOT-23-5 3D model

The mini-SIM slot will need to be replaced with one that has an active-LOW detection pin. Will want to see if we can find cheap electrolytic to replace a few of the tantalum caps with (not all since we still need some low ESR, high capacitance, low profile, caps).

For better BoM generation, added placeholders for SOM, disṕlay, camera, WWAN card and wifi/BT card.
Datasheet links and supplier information can be stored in these new library symbols.

Add FDV301N footprint based on the manufacturer's given recommended land pattern, use lower ESR 220uF tantalum capacitors in place of previously selected ones, re-export the BoM

Double checked FET footprints to make sure those assigned to the official SOT-23 footprint are correct.

Create SN74LVC1G332DCKR footprint based on the manufacturer's given example and assign it to the respective schematic symbol, assign it the official KiCad SC-70-6 3D model

Use LSM9DS1 manufacturer's recommended land and solder mask design pattern, include silkscreen notes on the axis directions, import LGA24 3D model and assign it

Add BLM18PG121SN1D chip ferrite beads to the GNSS, proximity+ambient light sensor, and IMU +3.3V power pins

Use the MX25L1606EZNI manufacturer's recommended land pattern

A combination of Macronix's "Recommended PCB Pad Layouts for 8-USON & 8-WSON Packages" (page 4) and "Macronix 209mil 8-SOP and 6x5mm 8-WSON Dual Layout" app notes were used in conjunction with KiCad's official DFN-S-8-1EP_6x5mm_Pitch1.27mm footprint to give a well-rounded pattern.

Add MIC2876 5V boost converter's footprint, assign it, assign it the DFN-8 3D model