In preperation for the final order, re-export all ...
by Eric Kuzmenko 6 years 2 months
In preperation for the final order, re-export all the manufacturing files using the current date and rev number v1.0.0

Add the fab's stackup, panel array working files, and their CPW calculations
Increment the version number for any new changes/f...
by Eric Kuzmenko 6 years 10 months
Increment the version number for any new changes/fixes which are made (v0.1.3)
Swap ECSPI1_MOSI and ECSPI1_MISO
by Eric Kuzmenko 6 years 10 months
Specify that the license is "GNU GPLv3+"
by Eric Kuzmenko 6 years 10 months
Increment the version number to v0.1.2 and improve...
by Eric Kuzmenko 6 years 10 months
Increment the version number to v0.1.2 and improve some parts of the routing, remove a pointless via found on Net-(D1701-Pad2) on a top layer track
Reduce the trace width of CLKO1 and CLKO2 on the i...
by Eric Kuzmenko 6 years 11 months
Reduce the trace width of CLKO1 and CLKO2 on the inner layers to 0.127mm in order to keep their impedance at 50Ohms throughout their length, do the same for SD2_~RST & WIFI_WAKE, remove a pointless stub found on CLKO1 near U1302, update the version number in the schematics to v0.1.1 and re-export the schematics' PDF
Update the issue date in the rev blocks
by Eric Kuzmenko 6 years 11 months
Make the backlight boost converter compensation ca...
by Eric Kuzmenko 6 years 11 months
Make the backlight boost converter compensation capacitor (C459) 10nF instead of 100nF (was a typo), make the charge controller's PMID capacitor (C302) 10uF instead of 8.2uF since it is a more common value and is what is being used on the charge controller's eval board, select a 10uF 0603 X5R capacitor rated for 25V for both the PMID cap and the 10uF cap on VBUS, update the .ods BoM with tolerances & ratings for the caps and resistors which will be supplied by the PCBA house, export the component-placement-list file (dvk-mx8m-bsb-all.pos) which gives the coordinates of all components with respect to the top-left fiducial mark, re-export the gerbers for preliminary review (add silkscreen which states that this is preliminary instead of a version number), make a few minor improvements to the board's routing in various spots, update the IMU footprint so that its silkscreen which gives the axis directions is visible on the board, some footprints were updated to be defined as SMD footprints in order to show up on the component-placement list (strictly through-hole components are not listed)

The 0603 10uF 25V caps have been ordered and will be shipped to wherever the assembly is done. This commit contains the preliminary materials which will be reviewed (BoM, .pos file, and gerbers all zipped).
Make the ENET_* traces on the top layer 53mils in ...
by Eric Kuzmenko 6 years 11 months
Make the ENET_* traces on the top layer 53mils in order to ensure they have a 50Ohm single-ended impedence, move one of the 5V_P bypass caps close to the SoM end of the USB2 diff pair, add meanders to the ENET_TXC, ENET_TX_CTL, ENET_RX_CTL in order to ensure these segments are matched to the long ENET_RXC segment (56.051mm, the rest of the RGMII signals are <10mm skew from this length and don't need adjusting, re-route the SIM card such that UIM-RESET is routed in between UIM-CLK and UIM-DATA as recommended by a BB manufacturer
Add a 5.29x27.14mm Purism logo to the "back" silks...
by Eric Kuzmenko 6 years 11 months
Add a 5.29x27.14mm Purism logo to the "back" silkscreen of the board, seen on the bottom left edge when facing the display, remove the old schematic rescue files which are remnants from the Kicad 5.0.0 upgrade
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