Dennis Field / dvk-mx8m-bsb - History

Place and route the battery thermistor circuit, add covered B.Cu pads to the footprints which have thermal exposed pads

Replace the 103HT NTC thermistor with a ERTJ1VG103FA as found in TI's TIDA-01182 eval board which has a charge controller IC from the same family and uses an 18650 battery, change is due to it being smaller, cheaper, and has the same B value as the recommended thermistor in the charge controller IC's datasheet, comparing the thermistors' tables shows that they are nearly identical and that it should be a drop-in replacement

Move the charge controller, USB-C TCPC, and RTC to I2C1

Since each of these ICs will be powered at the same time as the SoM regardless of the PWR_EN state, they should share the same I2C bus as the PMIC.

Use I2C3 bus instead of I2C1 bus based on EmCraft's feedback

Move USB-C, Mini-HDMI, RJ45, and 3.5mm jack receptacles to the bottom of the board, also place the Micro-SD card slot to the left of all of the receptacles centered at the bottom, place the Smart-Card slot just above the Micro-SD card facing the left, add 3D models to each of the respective connectors/sockets

The order of the various receptacles and sockets can be changed bit the pitch between them should stay about the same since it is currently as tightly packed asreasonably possible (1.5~2.5mm clearance between connectors).

Replace resistors which have specific values that can be converted to more common values in order to reduce the total number of unique BoM line items

Replace camera's schottky+resistor level-shifter circuit with the more functional TXB0101 dedicated IC

Change GRM219R61C226ME15L X5R 0805 22uF capacitor to being a CL10A226MP8NUNE X5R 0603 22uF capacitor