Dennis Field / dvk-mx8m-bsb - History

Add FDV301N footprint based on the manufacturer's given recommended land pattern, use lower ESR 220uF tantalum capacitors in place of previously selected ones, re-export the BoM

Double checked FET footprints to make sure those assigned to the official SOT-23 footprint are correct.

Create FSA6157L6X footprint, import and assign its MO-255 3D model

Create SGTL5000XNLA3R2 footprint and assign it KiCad's official UQFN-20-1EP_3x3mm_Pitch0.4mm 3D model

Add BLM18PG121SN1D chip ferrite beads to the GNSS, proximity+ambient light sensor, and IMU +3.3V power pins

Use PAM8301 manufacturer's TSOT26 recommanded pad layout modified from KiCad's official SOT-23-6 footprint

Add MIC2876 5V boost converter's footprint, assign it, assign it the DFN-8 3D model

Move the WLAN+BT M.2 sheet back to page 18 rather than the last page (24)

Update Bill-of-Materials format and include missing SEC1110 datasheet link, fixed lingering component properties typos

Add AC coupling caps to the HDMI_AUXP/N diff pair which were mistakenly left out, fix a couple typos/errors that were made when transitioning to the new top-leve sheet, make the M.2s' I2C RX TX hierarchical signals consistent and clearer

Hopefully all lingering errors have been caught, this will likely be the schematic commit that gets reviewed (fingers crossed).