PROJ - Gerber files major milestone - 05/05/19.

PROJ - Final pre-purchase revisions (4 boards still in progress.)

SC - Stage initial placement.

SC - Hand routing. Ready for autorouter.

TEMP - Initial board placement; Horizontal redo.

TEMP - Initial board placement.

PROJ - Workstation modified files. Git history had become polluted with multiple trivial commits. Git branching/merging policy will now be followed through GitHub. WLS system set up. Anshuman's git history caught up. All systems under management have now been merged at this common commit.

SC - Rev C; SC70 -> SOT23. For single logic gate components, SC70 was initially chosen. These packages proved too small to hand-solder. All SC70 packages have been refactored to SOT23. SparkFun DRC's added in for additional manufacturability.

TSMPC - Initial draft (WIP). Non-working commit of TSMPC. Done simply to show possible board layout.

SC - Added component numbers/names. Silkscreen was initially missing component names. As many of the original components were resistors/capacitors, Values were preferred. However, standard board markup convention requires that part numbers be given instead. Note: Part numbers are given on EAGLE layer tNames, whereas values are stated on tValues. Most CAM jobs will only import tNames onto final Gerber file layer for board silkscreen.