t3ddftw / BlueBus - History

[IMP] hardware: V2 System UART Fix
* Swap URX/UTX pins to maintain the same mapping as 1.x boards

[IMP] hardware: V2 silkscreen
* Add fiducial markings
* Fix issues with silkscreen

[IMP] hardware: v2.0 Silkscreen
* Update Bottom Silkscreen
* Renumber Resistors

[IMP] hardware: v2.0 TEL Circuit
* Add Series resistor and move MOSFETs and resistors around to support BJT usage

[IMP] hardware: V2 wiring and names
* Update GND_FLT trace routing away from board cutout
* Fix >NAME for some parts

[IMP] hardware: V2 Bugfixes and improvements
Bug fixes:
* Wire floating S/PDIF reset pin to MCU
* Add pull up to MCU pin 64 for board identification
Improvements:
* Added a 0.3mm isolation of the ground plane
* Switched by design rules to metric
* Moved the pin 1 indicators out from under the ICs to the side of pin 1
* Added outlines for all passives
* Moved over the impedance circuit for the S/PDIF output and kept the trace on the top layer
* Moved more traces off the bottom layer
* Moved the I2S lines to the top layer and reduced the VIA count from 11 to 5
* Revised all the packages in the design to ensure they matched the D/S. Specifically, the PIC24s package now has 0.3mm pads
* Set the minimum trace size to 0.25mm instead of 0.20mm
* Added more VIA floods for the ground plane to tie them together where the bottom layer gets bifurcated

[IMP] hardware: V2 Improvements
* Increase the footprint for C1 and fix the name location
* Remove PU/PD resistors from DIT4096
* Rewire I2S lines
* Fix ground pour polygon dimensions
* Replace 10ohm resistor for two parallel 20ohm
* Wire SMB ground to unfiltered ground
* Rename all connectors and ICs per convention
* Increase name size to 1mm at minimum
* Add additional ground VIAs