t3ddftw / BlueBus - History

[ADD] hardware: BlueBus v6
* Version bump for new PCB run
* Remove passives from IBus line causing I/O issues
* Rewire gain settings on TPA6017A2 to 10dB gain, rather than 15.7dB
* Ensure all vias are 0.51mm
* Add Thermal Pad (PWP) to TPA6017A2 and update footprint to make more sense in mm
* Rewire VIN
* Rewire 5v regulator BS pin to pull from 5v rail rather than SW line (pre-inductor) per the DS

[ADD] hardware: BlueBus BOM Updates
* Add GitHub link to Silkscreen
* Update Embedded BOM

[ADD] hardware: BlueBus v5 updates
* Remove external crystals
* Add pull up resistors to MCLR -- Bug in existing boards causing unstable operation
* Rewire BC127 UART lines to MCU

[ADD] hardware: BlueBus Board rev. 5
* Add primary 8MHz oscillator
* Wire EEPROM signals to compatible pins
* Rewire all capacitors so they are not inline with the power rail (Mostly on MCU)
* Update pins style to common size instead of the long pin pads
* Update size and location of mounting holes
* Rewire VIN to make room for mounting holes

[ADD] hardware: Power Management Updates
* Wire 5v regulator FB pin to GND
* Update BS Cap to 0.01uf from 0.1uf per the datasheet
* Add 100kohm resistor to EN pin of 5v regulator
* Rewire VIN and 5v Regulator
* Update 0.1uF cap on VIN of 3.3v LDO to 1uF per the datasheet
* Update 0.1uF cap on VOUT of 3.3v LDO to 2.2uF per the datasheet (>1.0uF required)
* Rewire Power Signals so they make more sense

[ADD] hardware: BT_UART I/O Change
* Re-wire BT_UART for FTDI cable compatability

[ADD] hardware: Minor board changes
* Add mounting holes
* Fix uneven pitch of crystal caps
* Replace wide through-hole pins with standard sized ones
* Update name of TPA6017A2 IC
* Update trace widths for 5v rail to .55mm

[ADD] hardware: BlueBus v4 Board Changes
* Remove BC127 LEDs
* Enlarge all IC pads to make SMD assembly easier
* Rewire 3.3v Rail into a star topology to do away with potential issues from dasiy chaining
* Rewire portions of the 5V rail
* Rewire MIC_IN Signals to make use of stereo audio
* Tighten up similar signals for better board routing
* Enlarge all vias to 0.51mm
* Elarge 5v rail to 0.55mm
* Tent all vias for a nicer silkscreen
* Update silkscreen positioning
* Remove wires from under TPA6013 since it contains a thermal pad

[ADD] hardware: Update Schematic and Board
* Remove local libraries that can be found by EAGLE automatically
* Rewire VIN side of the board
* Update D4 to be a 30V 2A Diode, instead of a 100V 250mA diode