[IMP] hardware: v1.5 High Voltage improvements * Remove XRP6759 * Remove Old Tantalum C1 * Remove V1 * Remove L1 * Add common mode choke at input (L1) to filter out A/C * Add new Aluminum Polymer input Capacitor rated for 35v (40v transcients) (C1) * Add MPQ4420 wide input voltage switching regulator for 12v -> 5v regulation * Add XC6702 to protect Q2 from trancients and provide a constant voltage to TEL ON and Microphone power * Power Microphone through 12v rail * Rewire 3.3v net * Rewire 5v net * Fix decoupling cap positioning for PIC24 * Fix decoupling cap positioning for FT232RL

[IMP] hardware: v1.2 minor update * Re-wire microphone input for less 45 degree turns

[IMP] hardware: V 1.2 * Power PAM8406 PVDDR and add bypass caps * Rework layout for PAM8406 and its passives * Connect floating VIAs to ground

[IMP] hardware: V 1.1 * Reroute 3.3v rail under the PIC24 to prevent ground returns on the second layer from having to take a longer route * Bring 5v rail to top layer for a short run in order to open the ground return path (to the left of the PIC24) * Leave pin 3 of the SPKR_OUT connector floating to prevent audio channel grounding on certain models * Add space between the edge of the analog audio ground plane end and the R/L channel traces * VIA stitch layers around the ground "bridge" (right above the BlueBus name on the Silkscreen) * Increase GND bridge to 1mm from 0.75mm * Increase BC127 pad size to allow more paste to fill the castellations * Bring RC filter for BC127 closer to power pin

[IMP] hardware: Add via to create ground pour * Add VIA to area without a GND pour * Alter AGND routing slightly

[IMP] hardware: Production V1 * Fix issue with silkscreen names * Add ground VIA

[IMP] hardware: Production V1 * Add Fiducials * Fix bugs with PCM5122 DGND being floating and VCOM not being tied to AGND * Adjust routing so that all traces intersect at 90 degree angles on different layers * Adjust traces to not follow the same track on different sides of the board * Add additional ground stiches * Improve placement of decoupling caps for superior ground returns

[IMP] hardware: Update Varistor wiring * Improve Schematic drawing for circuit protection

[IMP] hardware: Revision D.1 * Remove errant layers

[IMP] hardware: Rev D.2 * Remove debug pads * Reroute Audio pairs from DAC * Additional Ground VIAs