[IMP] firmware: Break Bootload out of Application * Move Bootloader code over to its own project * Update gld scripts and build configurations to match project names * Devise Communication protocol for host to communicate with bootloader * Devise method of flashing firmware to MCU

[ADD] firmware: Begin Bootloader * Add Build config for application / bootloader * Add Application/Bootloader Linker Scripts (Default for now). * Remove gitignore for Makefiles for each configuration so that others can build it correctly too * Move System configuration to config.h so it can be included in both

[ADD] hardware: Update PWP * Correctly add tStop/bStop layer to TPA6017A2 to remove silkscreen from thermal pad

[ADD] hardware: BlueBus v6 * Version bump for new PCB run * Remove passives from IBus line causing I/O issues * Rewire gain settings on TPA6017A2 to 10dB gain, rather than 15.7dB * Ensure all vias are 0.51mm * Add Thermal Pad (PWP) to TPA6017A2 and update footprint to make more sense in mm * Rewire VIN * Rewire 5v regulator BS pin to pull from 5v rail rather than SW line (pre-inductor) per the DS

[ADD] firmware: Production Updates * Disable ADC for used ports * Remove Prototype board mappings * Remove system.c after merging it into main.c * Remove calls to disable ADC on EEPROM ports, since this is handled en-mass

[ADD] hardware: BlueBus BOM Updates * Add GitHub link to Silkscreen * Update Embedded BOM

[ADD] hardware: BlueBus v5 updates * Remove external crystals * Add pull up resistors to MCLR -- Bug in existing boards causing unstable operation * Rewire BC127 UART lines to MCU

[ADD] firmware: Production board updates * Update pin configurations * Add Prototype board configurations for pins in comments * Remove external crystal configuration and use FRC instead * Use PICKIT4 * Update Configuration to use GA606 device

[ADD] hardware: BlueBus Board rev. 5 * Add primary 8MHz oscillator * Wire EEPROM signals to compatible pins * Rewire all capacitors so they are not inline with the power rail (Mostly on MCU) * Update pins style to common size instead of the long pin pads * Update size and location of mounting holes * Rewire VIN to make room for mounting holes

[ADD] hardware: Power Management Updates * Wire 5v regulator FB pin to GND * Update BS Cap to 0.01uf from 0.1uf per the datasheet * Add 100kohm resistor to EN pin of 5v regulator * Rewire VIN and 5v Regulator * Update 0.1uF cap on VIN of 3.3v LDO to 1uF per the datasheet * Update 0.1uF cap on VOUT of 3.3v LDO to 2.2uF per the datasheet (>1.0uF required) * Rewire Power Signals so they make more sense