t3ddftw / BlueBus - History

[IMP] firmware: Break Bootload out of Application
* Move Bootloader code over to its own project
* Update gld scripts and build configurations to match project names
* Devise Communication protocol for host to communicate with bootloader
* Devise method of flashing firmware to MCU

[ADD] firmware: Begin Bootloader
* Add Build config for application / bootloader
* Add Application/Bootloader Linker Scripts (Default for now).
* Remove gitignore for Makefiles for each configuration so that others can build it correctly too
* Move System configuration to config.h so it can be included in both

[ADD] hardware: Update PWP
* Correctly add tStop/bStop layer to TPA6017A2 to remove silkscreen from thermal pad

[ADD] hardware: BlueBus v6
* Version bump for new PCB run
* Remove passives from IBus line causing I/O issues
* Rewire gain settings on TPA6017A2 to 10dB gain, rather than 15.7dB
* Ensure all vias are 0.51mm
* Add Thermal Pad (PWP) to TPA6017A2 and update footprint to make more sense in mm
* Rewire VIN
* Rewire 5v regulator BS pin to pull from 5v rail rather than SW line (pre-inductor) per the DS

[ADD] firmware: Production Updates
* Disable ADC for used ports
* Remove Prototype board mappings
* Remove system.c after merging it into main.c
* Remove calls to disable ADC on EEPROM ports, since this is handled en-mass

[ADD] hardware: BlueBus BOM Updates
* Add GitHub link to Silkscreen
* Update Embedded BOM

[ADD] hardware: BlueBus v5 updates
* Remove external crystals
* Add pull up resistors to MCLR -- Bug in existing boards causing unstable operation
* Rewire BC127 UART lines to MCU

[ADD] firmware: Production board updates
* Update pin configurations
* Add Prototype board configurations for pins in comments
* Remove external crystal configuration and use FRC instead
* Use PICKIT4
* Update Configuration to use GA606 device

[ADD] hardware: BlueBus Board rev. 5
* Add primary 8MHz oscillator
* Wire EEPROM signals to compatible pins
* Rewire all capacitors so they are not inline with the power rail (Mostly on MCU)
* Update pins style to common size instead of the long pin pads
* Update size and location of mounting holes
* Rewire VIN to make room for mounting holes

[ADD] hardware: Power Management Updates
* Wire 5v regulator FB pin to GND
* Update BS Cap to 0.01uf from 0.1uf per the datasheet
* Add 100kohm resistor to EN pin of 5v regulator
* Rewire VIN and 5v Regulator
* Update 0.1uF cap on VIN of 3.3v LDO to 1uF per the datasheet
* Update 0.1uF cap on VOUT of 3.3v LDO to 2.2uF per the datasheet (>1.0uF required)
* Rewire Power Signals so they make more sense